Electrical Device Package Phosphate Glass Coating
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Solution Overview
Problem
Conventional electrical device packaging processes face issues such as discontinuity in inside and outside connections due to the absence of end plastic, leading to zinc phosphate formation and increased defect rates, along with the formation of high impedance layers and perforations that cause electroplating solution leaks.
Innovation Solution
A manufacturing method involving the formation of a phosphate salt protective layer on the electrical device body, followed by a glass protective layer, with the plastic material being removed through thermal treatment to prevent impedance layer formation and enhance protection, while allowing for electroplating without damaging the device or electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrode is dipped in phosphate salt to form zinc phosphate, then protective coating is formed on the electrode, but discontinuity in inside and outside connection is caused and perforations forming like a net are formed on the surface
Solution Approach 1:
The protective coating process is segmented into two distinct stages: first forming a zinc phosphate layer on the electrode surface, then forming a glass layer on top of it. This segmentation allows each layer to perform its specific function without interfering with the other, preventing the net-like perforations while maintaining connection continuity.
Solution Approach 2:
The patent uses a composite protective structure consisting of zinc phosphate and glass materials. The glass layer is formed over the zinc phosphate layer, creating a composite coating that combines the corrosion resistance of zinc phosphate with the sealing and protective properties of glass, thereby eliminating perforations while maintaining structural integrity.
2Reliability
If phosphate salt is used to form protective layer on the electrical device body, then corrosion protection is improved, but high impedance layer is formed on the electrode
Solution Approach 1:
The patent introduces plastic material as an intermediary protective layer that covers the electrode before the phosphate salt treatment. This intermediary layer prevents the phosphate salt from directly contacting and forming high impedance compounds on the electrode surface, while still allowing the formation of a protective zinc phosphate layer on the electrical device body where needed.
Solution Approach 2:
The patent applies different protective treatments to different areas: the electrode surface is protected by plastic material to prevent impedance layer formation, while the electrical device body surface receives the phosphate salt treatment for corrosion protection. This localized application ensures each area gets the appropriate protection without adverse effects.
3Reliability
If plastic material covers the electrode outer surface, then electrode protection is improved, but removal of plastic material becomes necessary after protective layer formation
Solution Approach 1:
The plastic material is applied as a preliminary protective measure before the phosphate salt and glass layer formation. This preliminary action protects the electrode during the subsequent processing steps, and the plastic material is designed to be easily removable after the protective layers are established, simplifying the overall manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method effectively prevents damage to electrical devices and electrodes by forming a productive glass layer on a phosphate salt layer, reducing defect rates and avoiding high impedance issues, while allowing for easy removal of plastic materials during thermal processing.
Implementation Method 1
the electrode is dipped in phosphate salt and is reacted with the electrical device to form zinc phosphate
Implementation Method 2
forming a second protective layer including glass at least on an exposed outer surface of the first protective layer
Implementation Method 3
the pre-formed layer of the first protective layer is processed with 700° C. to 800° C. to form the first protective layer and remove the plastic material
Implementation Method 4
after forming the protective layer including glass at least on the exposed outer surface of the electrical device body, removing the plastic material
Data Source
AI summary
An electrical device package structure and manufacturing method thereof is disclosed. The manufacturing method comprises: providing an electrical device body having at least two electrodes, wherein an outer surface of the electrical device body is partially covered by the electrodes, and outer surfaces of the electrodes are covered by a plastic material; forming a first protective layer including phosphate salt at least on the exposed outer surface of the electrical device body; and forming a second protective layer including glass at least on an exposed outer surface of the first protective layer. The present invention can prevent the electrical device body and/or the electrodes from being damaged on their manufacturing process, and avoid a forming high impedance layer on an electrode.