Integrated Electrical Component Support for Sealed Heat Dissipation
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Solution Overview
Problem
The manufacturing of electronic modules with power semiconductors is complex, expensive, and time-consuming due to stringent insulation requirements, multiple heating cycles, and the need for complex module housings and adhesive bonding processes, along with significant investment costs for molds and automated assembly machines.
Innovation Solution
A carrier for electrical components featuring a heat sink with side walls and sealing blocks that replace the module housing, incorporating a heat-spreading copper layer and a support structure, which simplifies assembly and eliminates the need for a separate module housing, reducing the complexity and cost of manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a complex module housing with adhesive bonding is used to prevent potting compound flow, then sealing reliability is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent combines the housing structure and sealing function into a single integrated carrier component. The carrier includes side walls that directly contain the potting compound without requiring separate housing parts and adhesive bonding, eliminating the need for complex assembly while maintaining sealing reliability.
Solution Approach 2:
The carrier serves multiple functions simultaneously: it provides mechanical support for electrical components, contains the potting compound through its side walls, and eliminates the need for separate sealing mechanisms. This multi-functionality reduces overall device complexity while maintaining reliability.
2Strength
If multiple heating cycles for adhesive bonding and potting compound curing are performed, then bonding strength is improved, but manufacturing time increases
Solution Approach 1:
The patent extracts and eliminates the adhesive bonding step from the manufacturing process. By using a carrier with integrated side walls for containing the potting compound, the need for separate adhesive application and multiple heating cycles is removed, significantly reducing manufacturing time while maintaining structural integrity.
3Reliability
If a separate module housing and base plate are used, then component support and sealing are improved, but manufacturing cost increases
Solution Approach 1:
The patent merges the base plate and module housing functions into a single carrier structure. The carrier includes a support surface for mounting electrical components and side walls for containing the potting compound, eliminating the need for separate base plate and housing components, thereby reducing manufacturing cost and assembly complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the manufacturing process, reduces costs, and enhances heat dissipation, allowing for higher load capacity and extended service life of electrical components by eliminating the need for a separate module housing and adhesive bonding, while improving heat transfer and reducing parasitic inductances.
Implementation Method 1
a heat sink with a heat sink surface and two opposing side walls projecting from the heat sink surface... incorporating a heat-spreading copper layer... enhances heat dissipation, allowing for higher load capacity and extended service life... improving heat transfer
Data Source
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AI summary
The invention relates to a support (3) for at least one electrical component (5 to 7). The support (3) comprises a cooling body (11) having a cooling body surface (31) and two opposing lateral walls (25) protruding from the cooling body surface (31), two spaced-apart sealing blocks (13) lying on the cooling body surface (31), each extending between the two lateral walls (25) and being in contact with each of the two lateral walls (25), and a support structure (15) for the at least one electrical component (5 to 7) arranged on the cooling body surface (31) between the two sealing blocks (13).