Electrical Terminal Structure for Thin-Support Cable Connections
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Solution Overview
Problem
Existing electrical terminals for connecting cables to electrical circuits on thin supports face issues with mechanical resistance and quality due to low-temperature resistance of the substrate, leading to disconnections and aging problems, especially when using soldering or conductive glue.
Innovation Solution
An electrical terminal with a connection part and base part, featuring a ring penetration means that penetrates through the thin support, ensuring mechanical stability and electrical connection, while using a dielectric substrate and non-coplanar ring penetration means to maintain the terminal on the support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering technique is used to connect terminal to antenna on thin support, then electrical connection is achieved, but the substrate cannot withstand high-temperature causing connection failure
Solution Approach 1:
The patent extracts the harmful high-temperature soldering process from the connection method. Instead of using traditional soldering that requires high temperature, the invention uses a mechanical pressing connection system where the terminal is pressed onto the antenna substrate, eliminating the need for thermal processing that the thin substrate cannot withstand.
Solution Approach 2:
The patent replaces the thermal field (soldering) with a mechanical field (pressing connection). The terminal incorporates metallic pads and connection elements that establish electrical contact through mechanical pressure rather than thermal bonding, allowing the thin substrate to remain intact while achieving reliable electrical connection.
2Temperature
If conductive glue is used to connect terminal to thin support, then low-temperature connection is achieved, but mechanical resistance is poor causing disconnections
Solution Approach 1:
The patent replaces the chemical bonding mechanism (conductive glue) with a mechanical interlocking system. The terminal design includes metallic rings, pads, and pressing elements that create strong mechanical bonds through physical contact and friction, eliminating the need for weak adhesive bonds while maintaining low-temperature processing.
Solution Approach 2:
The patent employs composite construction combining dielectric substrate with metallic reinforcement elements (metallic pads, metallic rings). This composite structure provides both the electrical conductivity needed for signal transmission and the mechanical strength required for robust connection, without relying on weak adhesive materials.
3Ease of manufacture
If terminal is pressed onto thin support, then electrical connection is established, but mechanical stability is insufficient leading to aging problems
Solution Approach 1:
The patent divides the connection interface into multiple discrete contact points including center pin, surrounding metallic ring, and multiple metallic pads distributed across the terminal structure. This segmentation distributes the mechanical and electrical load across numerous contact points, preventing single-point failure and enhancing overall connection stability and reliability.
Data Source
AI summary
An electrical terminal for electrically connecting a cable to an electrical circuit, especially an antenna, disposed on a thin support comprising a connection part that includes a center-pin, and a surrounding metallic ring and a base part that includes a dielectric substrate having a top surface and a bottom surface, a ring metallic pad electrically connected to the surrounding metallic ring, and a pin metallic pad electrically connected to the center-pin and electrically isolated from the ring metallic pad; the ring metallic pad and the pin metallic pad being disposed on the bottom surface; the connection part being disposed on the top surface of the base part and extending substantially perpendicular to the top surface. The base part further comprises a ring penetration means designed to penetrate through the thin support. The dielectric substrate and the ring penetration means are not coplanar.