Electrically Debondable 2K Adhesive Composition for Fast Disassembly
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Solution Overview
Problem
Existing adhesive compositions are difficult to disassemble without damaging the substrates, and methods like mechanical removal or chemical dissolution are time-consuming and can harm the substrates.
Innovation Solution
A two-part curable adhesive composition comprising (meth)acrylate monomer, co-polymerizable acid, electrolyte, and curing agents, which can be debonded by applying an electrical potential across the cured adhesive.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive bonds are used to join substrates, then bond strength and stress distribution are improved, but disassembly becomes difficult and time-consuming
Solution Approach 1:
The adhesive composition changes its bonding parameters in response to electrical stimulation. The electrolyte-containing formulation enables electrochemical reactions that alter the adhesive's bonding state, allowing it to transition from a strong bonded state to a debonded state when voltage is applied, thus enabling rapid disassembly without mechanical or chemical processing
Solution Approach 2:
The patent replaces mechanical disassembly methods (sand blasting, wire brushing) with an electrical field-based debonding mechanism. By applying voltage across the bonded joint, electrochemical reactions occur within the electrolyte-containing adhesive, generating gas bubbles and thermal effects that disrupt the adhesive-substrate interface, enabling non-mechanical disassembly
2Ease of repair
If mechanical removal processes are used to remove adhesive, then adhesive can be removed, but substrate surfaces are damaged and become inaccessible
Solution Approach 1:
The patent replaces mechanical removal processes with an electrical field-induced debonding mechanism. The electrolyte-containing adhesive undergoes electrochemical reactions when voltage is applied, producing gas evolution and thermal effects that disrupt the adhesive-substrate interface without physical contact, thereby removing adhesive without damaging substrate surfaces
Solution Approach 2:
The electrolyte acts as an intermediary medium that enables non-contact debonding. When voltage is applied, the electrolyte facilitates electrochemical reactions at the adhesive-substrate interface, generating intermediate products (gas bubbles, heat) that mediate the separation process, allowing adhesive removal without direct mechanical action on the substrate
3Ease of repair
If chemical dissolution or high temperature methods are used to debond adhesive, then adhesive can be removed, but the process becomes complex and substrates may be damaged
Solution Approach 1:
The patent replaces complex chemical dissolution processes and high-temperature methods with a simpler electrical field-based debonding approach. The electrolyte-containing adhesive responds directly to applied voltage through electrochemical reactions, eliminating the need for complex chemical baths or temperature control systems, thereby simplifying the debonding process while protecting substrates from damage
Solution Approach 2:
The patent changes the operational parameters of the adhesive by incorporating electrolytes that enable electrochemical responses to electrical fields. This parameter modification allows the adhesive to be debonded through simple voltage application rather than complex chemical or thermal processes, reducing process complexity while maintaining effective debonding capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive composition effectively bonds substrates and can be easily debonded by applying a voltage, maintaining substrate integrity and simplifying disassembly.
Implementation Method 1
the electrolyte provides sufficient ionic conductivity to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Data Source
AI summary
The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: (meth)acrylate monomer; co-polymerizable acid; and, an electrolyte; and, ii) a second part comprising: a first curing agent for the monomers of said first part; a second curing agent for the monomers of said first part; and, a solubilizer.