Electrically Detachable Adhesive Mass for Composite Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current adhesive technologies face challenges in effectively debonding from substrates, especially on low-energy surfaces, requiring extensive reworking and lacking efficient detachment methods that do not compromise adhesive strength.
Innovation Solution
An adhesive mass containing a polydia block copolymer and an electrolyte, such as ionic liquids, which allows for electrical detachment by creating a voltage, maintaining adhesive strength and facilitating clean and easy replacement without residue.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If heat-mediated separation processes are used to reduce adhesive cohesion, then manual separation becomes possible, but extensive rework is required to prepare the substrate surface contaminated with adhesive residue
Solution Approach 1:
The patent replaces heat-mediated separation with an electrical field-based separation mechanism. By incorporating conductive particles into the adhesive layer, the bond can be broken by applying an electrical voltage that generates electrostatic forces to detach the adhesive from the substrate, eliminating the need for thermal processing and subsequent manual cleaning operations.
Solution Approach 2:
The patent changes the separation mechanism from thermal (heat-based) to electrical (voltage-based). This parameter change allows for controlled detachment by adjusting voltage levels, providing a more precise and cleaner separation process that avoids the contamination and extensive rework associated with thermal methods.
2Ease of operation
If acrylate adhesives are used for electrical separation processes, then voltage application can reduce adhesive strength, but the adhesives lack sufficient stickiness especially on low-energy surfaces
Solution Approach 1:
The patent creates a composite adhesive system combining non-conductive adhesive matrix material with conductive particles (such as metal particles, carbon black, or graphitic carbon). This composite structure allows the adhesive to maintain its bonding strength on low-energy surfaces while acquiring electrical conductivity, enabling both strong adhesion and electrical removability.
Solution Approach 2:
The conductive particles act as an intermediary that bridges the adhesive matrix and the electrical field. These particles enable the transmission of electrical forces through the adhesive layer without compromising the adhesive's bonding properties, allowing voltage application to reduce adhesive strength for easy removal while maintaining initial stickiness.
3Reliability
If adhesive-dissolving technologies using penetrating solvents are used, then high and permanently reliable bond strength can be achieved, but the process is difficult to implement or takes a very long time to apply
Solution Approach 1:
The patent replaces solvent-based chemical dissolution with an electrical field-based separation mechanism. The conductive particles in the adhesive layer respond to applied voltage by generating electrostatic forces that detach the adhesive bond, providing a faster and simpler alternative to lengthy solvent penetration processes while maintaining reliable bonding during normal operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The adhesive mass provides strong and reliable adhesion to both high and low-energy surfaces, enabling easy and clean electrical detachment, optimizing the balance between adhesion and detachment processes.
Implementation Method 1
the adhesive can be electrically removed even after bonding by applying a voltage
Implementation Method 2
an adhesive compound that adheres well to substrates with low-energy surfaces
Data Source
Figure 1~3
Figure 4~5
Figure 6~7
AI summary
The invention relates to an adhesive compound, an adhesive tape, a bonded assembly, a method for electrically releasing the bonded assembly, and the use of the adhesive compound for bonding components in electronic devices, automobiles, medical devices, and dental devices. The adhesive compound comprises at least one electrolyte and a base compound, wherein the base compound comprises at least one polydiene block copolymer and at least one adhesive resin.