Electro Acoustic Filter Structure to Prevent Dicing Chipping
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional manufacturing processes for electro acoustic filter components often result in defects during the dicing process, leading to imperfect hermetical sealing and degradation of acoustic and electro acoustic performance.
Innovation Solution
The design features a piezoelectric material with intact, plane sides, and an optional functional layer with plane sides, both protected by a thin film package. The piezoelectric material and functional layer are structured to be smaller than the carrier substrate, avoiding dicing defects and enhancing hermetical sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If dicing is performed through the carrier substrate and functional layers to separate individual components, then productivity is improved through batch manufacturing, but chipping defects occur on the side surfaces of the piezoelectric material and functional layers
Solution Approach 1:
The patent divides the processing sequence into two distinct stages: first dicing the carrier substrate to separate individual components, then subsequently removing the functional layers from the diced substrate. This segmentation allows the dicing process to focus only on the substrate material, avoiding chipping of the functional layers while maintaining batch manufacturing efficiency
Solution Approach 2:
The patent performs the dicing operation on the carrier substrate before the functional layers are deposited or attached. By completing the substrate separation in advance, the subsequent functional layer processing occurs on already-separated components, eliminating the risk of chipping during layer separation while preserving the benefits of batch processing
2Manufacturing precision
If the piezoelectric material and functional layers are kept small to avoid dicing defects, then manufacturing precision is improved, but the area available for acoustic wave oscillation is reduced
Solution Approach 1:
The patent separates the carrier substrate from the functional layers in the processing sequence, allowing the substrate to be diced to a size optimized for manufacturing precision while the functional layers can be designed with larger active areas on the individual substrate pieces, thus resolving the conflict between size constraints and oscillation area requirements
3Productivity
If conventional dicing processes are used to separate components, then productivity is improved, but hermetical sealing is compromised due to chipping defects
Solution Approach 1:
The patent divides the manufacturing process into sequential stages where the carrier substrate is diced first to maintain batch productivity, then functional layers are processed on individual components. This ensures that the critical hermetical sealing surfaces of the functional layers are not exposed to dicing operations, eliminating chipping defects while preserving manufacturing efficiency
Solution Approach 2:
By completing the substrate dicing operation before functional layer deposition or attachment, the patent ensures that the functional layers are formed on already-separated components with intact surfaces. This preliminary separation action protects the hermetical sealing quality of the functional layers while maintaining the productivity benefits of batch substrate processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the acoustic and electro acoustic performance of the filter components by preventing chipping and ensuring intact sides of the piezoelectric and functional layers, thereby enhancing hermetical sealing and reducing environmental exposure.
Implementation Method 1
electro acoustic resonators such as BAW resonators (BAW=bulk acoustic wave) or SAW resonators (SAW=surface acoustic wave) where an electrode structure is in contact with a piezoelectric material and—when an RF signal is applied to the electrode structure—converts between acoustic and electromagnetic RF signals
Data Source
AI summary
An electro acoustic filter component with improved acoustic and/or electro acoustic performance is provided. The component comprises a piezoelectric material (PM) the sides of which are plane and preferably free from chipping defects. The piezoelectric material may be arranged above a carrier substrate (CS). A functional layer (FL) with plane sides may be arranged above an electrode structure (ES) as trimming, TCF or passivation layer. In the manufacturing method the piezoelectric material and the functional layer are removed from the dicing line, such that no chipping occurs for these layers.