Electro-Fluidic Positioning Stage for High-Throughput Die Placement
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Solution Overview
Problem
Current semiconductor die-bonding technologies face challenges in achieving high precision and throughput due to the limitations of electromagnetic motors and piezo-electric actuators, which hinder efficient placement of semiconductor dies on substrates.
Innovation Solution
The development of an actuator stage utilizing electro-fluidic transport substrates with arrays of electrodes, a dielectric layer, and immiscible liquids to achieve precise motion of a carrier layer, enabling high-precision positioning of semiconductor dies on substrates with improved throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If electromagnetic motors and piezo-electric actuators are used for die placement, then positioning precision can be achieved, but throughput is limited and device complexity increases
Solution Approach 1:
The patent replaces electromagnetic motors and piezo-electric actuators with electrostatic actuators that use electrostatic fields to move dielectric membranes. This substitution eliminates the mechanical complexity of traditional motors while enabling faster, more precise control of multiple heads simultaneously, thereby improving both placement accuracy and throughput
Solution Approach 2:
The patent divides the die placement system into multiple independent heads (at least two heads) that can operate simultaneously on the same substrate. Each head has its own electrostatic actuator, allowing parallel processing and significantly increasing throughput while maintaining precision through independent control of each head
2Productivity
If multiple heads are deployed to increase throughput, then productivity improves, but device complexity increases due to bulk motors and actuators
Solution Approach 1:
The patent replaces bulk electromagnetic motors with planar electrostatic actuators consisting of electrode arrays and dielectric membranes. This reduces the mechanical footprint and complexity of each actuator, enabling multiple heads to be integrated on a single substrate without proportionally increasing overall system complexity
Solution Approach 2:
The patent merges multiple electrode arrays and dielectric membranes into a single integrated substrate structure. The electrode arrays are formed on the substrate, with dielectric membranes deposited over them, creating a compact, multi-headed actuator system that reduces overall device complexity while enabling parallel operation
3Productivity
If wafer-to-wafer bonding with parallel processing is used, then throughput improves, but flexibility and simplicity are sacrificed due to geometry matching requirements
Solution Approach 1:
The patent uses electrostatic actuators with dielectric membranes that can be dynamically controlled to adjust the position and orientation of each head independently. This dynamic control allows adaptation to different component geometries and substrate configurations, maintaining flexibility while enabling parallel processing for improved throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise and efficient positioning of semiconductor dies, combining the advantages of simplicity and flexibility with high throughput, thereby addressing the limitations of existing technologies.
Implementation Method 1
a set of arrays of electrodes at a spatial frequency... appropriate powering of the electrodes effectuates translation (i.e., motion) of the carrier layer
Implementation Method 2
a fluidic layer disposed over the hydrophobic surface and including a first non-conductive liquid and a second conductive liquid, wherein the first and second liquids are immiscible
Data Source
AI summary
An actuator, for precision positioning of a component, includes a base layer having a surface defining a z-axis normal to the surface; a set of electro-fluidic transport substrates, disposed on the base layer, and a control port, coupled to the array of electrodes in each of the electro-fluidic transport substrates, configured to cause motion of a carrier layer therein.