Electro-Optic Modulator Electrode Layout for Crosstalk Suppression

The patent introduces ground electrodes as intermediary elements positioned between adjacent signal electrodes. These ground electrodes act as electromagnetic shields that intercept and redirect electric field lines, preventing direct coupling between signal electrodes. The ground electrodes are connected to ground potential, creating equipotential surfaces that block the harmful electric field interaction while maintaining compact signal electrode spacing for miniaturization.

The electrode structure is segmented into alternating signal electrodes and ground electrodes rather than using continuous electrode structures. This segmentation creates distinct electromagnetic zones where ground electrodes isolate signal electrodes from each other. The segmented arrangement allows signal electrodes to be positioned close together for compactness while ground electrodes provide periodic isolation barriers that reduce cumulative crosstalk effects.

The patent merges the grounding function into the electrode structure itself by making the ground electrodes integral parts of the modulator assembly rather than separate connected components. Multiple ground electrodes are electrically connected through low-inductance pathways that are structurally integrated with the electrode supports and substrates, combining grounding functionality with the mechanical structure to minimize additional parasitic elements.

The grounding connection transitions from traditional three-dimensional wire connections to two-dimensional planar connections within the electrode plane. Ground electrodes are positioned coplanarly and connected through wide-trace printed circuit board patterns or metallization layers that provide low-inductance paths. This dimensional change from vertical wire connections to horizontal planar connections reduces loop area and associated parasitic inductance.