Electro-Optic Modulator Metal Electrode Multiplexing for Miniaturization
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electro-optic modulators have complex peripheral circuits, large size, and high costs, which hinder component miniaturization.
Innovation Solution
An electro-optic modulator design that utilizes a metal electrode for multiplexing signal and power input through open-circuit direct-current coupling, eliminating the need for peripheral circuits and incorporating a symmetrical modulation electrode structure for push-pull modulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If single-end alternating-current coupling is adopted for modulation electrode design, then signal processing capability is maintained, but device complexity increases and size increases
Solution Approach 1:
The patent combines the signal input function and power supply function into a single metal electrode structure. The metal electrode serves dual purposes: receiving modulation signals from the radio frequency driver and providing bias voltage to the driver, thereby eliminating the need for separate peripheral circuits and reducing overall device complexity
Solution Approach 2:
The metal electrode is designed to perform multiple functions simultaneously: it acts as both a signal transmission conductor and a power supply terminal. This multi-functional design allows the electrode to receive both AC modulation signals and DC bias voltage through open-circuit direct-current coupling, reducing the number of components needed
2Ease of operation
If single-end alternating-current coupling is adopted for modulation electrode design, then signal processing capability is maintained, but device size increases
Solution Approach 1:
The patent merges multiple circuit functions into a compact metal electrode structure, eliminating the need for separate capacitors, inductors, and bias tees that would otherwise occupy significant space. This integration dramatically reduces the footprint of the modulator while maintaining full signal processing capability
Solution Approach 2:
The design nests multiple functional layers within the metal electrode structure, where the electrode itself contains both signal and power pathways. This nested configuration allows complex functionality to be achieved within a minimized spatial envelope
3Ease of operation
If complex peripheral circuits are disposed for signal processing, then signal processing capability is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts and eliminates unnecessary peripheral circuit components such as capacitors, inductors, and bias tees from the traditional design. By removing these extra components and retaining only the essential metal electrode structure, the design achieves signal processing capability with reduced manufacturing complexity and lower costs
4Productivity
If symmetrical modulation electrode structure is adopted for push-pull modulation, then modulation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs asymmetrical electrode configurations within the symmetrical push-pull structure, where modulation electrodes are positioned at different locations relative to the optical waveguide. This controlled asymmetry enables effective push-pull modulation by creating opposing electric fields that efficiently modulate the optical signal while maintaining overall structural symmetry for balanced performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the size and cost of the modulator while improving modulation efficiency and ensuring high transmission quality without introducing additional components, facilitating miniaturization and integration.
Implementation Method 1
A second end of the metal electrode is coupled to a direct-current voltage end, and the direct-current voltage end is configured to input a voltage signal, and provide a bias voltage for the radio frequency driver by using the metal electrode
Implementation Method 2
The modulation electrode is configured to perform electro-optic modulation on the optical waveguide layer based on the modulation signal
Data Source
Figure 1~3
Figure 3a~3c
Figure 3d~4
AI summary
An electro-optic modulator, an optical chip, and an integrated chip are provided. The electro-optic modulator is disposed on a surface of a substrate (01). The electro-optic modulator includes: an optical waveguide layer (002) disposed on the substrate (01), a modulation electrode (003) disposed on the optical waveguide layer (002), and a metal electrode (004) disposed on the modulation electrode (003) and electrically connected to the modulation electrode (003). A first end of the metal electrode (004) is coupled to a radio frequency driver, and receives a modulation signal input by the radio frequency driver. The modulation electrode (003) is configured to perform electro-optic modulation on the optical waveguide layer (002) based on the modulation signal. A second end of the metal electrode (004) is coupled to a direct-current voltage end, and the direct-current voltage end is configured to input a voltage signal and provide a bias voltage for the radio frequency driver by using the metal electrode (004). The electro-optic modulator multiplexes the metal electrode (004), and a complex peripheral circuit does not need to be disposed. This reduces costs and a size of the electro-optic modulator, and is conducive to device miniaturization.