Electro-optic Module Heat Radiation Member Design
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Solution Overview
Problem
Existing electro-optic modules in projection type display devices face inefficiencies in heat dissipation due to low thermal conductivity materials used in adhesives and frames, leading to increased temperatures and reduced display quality.
Innovation Solution
Incorporating a heat radiation member made of higher thermal conductivity material than the first light-transmissive plate, overlapping it with the exposed portion of the plate to efficiently release heat generated in the electro-optic panel, while also using a first light-transmissive plate to prevent dust from adhering to the electro-optic material layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high thermal conductivity mold resin is used as adhesive to fix the liquid crystal panel to the frame, then the adhesive bonding is improved, but the thermal conductivity is still lower than metal and heat release efficiency deteriorates
Solution Approach 1:
The patent uses a composite structure combining resin body with metal film layers (including high thermal conductivity metal particles) to create a frame that achieves both strong bonding and high heat release efficiency. The composite material integrates the adhesive properties of resin with the thermal conductivity of metal.
Solution Approach 2:
The patent changes the thermal conductivity parameter of the frame by incorporating metal films and high thermal conductivity metal particles into the resin body, transforming it from a low thermal conductivity material to a high thermal conductivity composite material that can efficiently release heat.
2Strength
If a metal film is formed on the surface of a resin body to create the frame, then the structural integrity is improved, but the thermal conductivity of the frame remains low and heat release efficiency deteriorates
Solution Approach 1:
The frame is constructed as a composite material combining resin body with multiple metal film layers and high thermal conductivity metal particles. This composite structure maintains the structural integrity provided by the resin while introducing high thermal conductivity pathways through the metal components.
Solution Approach 2:
The patent applies different material properties to different parts of the frame structure - the resin body provides structural integrity and bonding, while the metal films and metal particles concentrated in specific regions provide high thermal conductivity for heat release.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces temperature-related deterioration in display quality by enhancing heat dissipation and preventing dust interference, ensuring improved image projection.
Implementation Method 1
a heat radiation member that is provided so as to be overlapped on the opposite side of the first substrate to the second substrate in at least a part of an exposed portion from the first light-transmissive plate of the first substrate, and is made of a material higher in thermal conductivity than the first light-transmissive plate
Data Source
AI summary
A first light-transmissive plate is provided on an opposite surface of a first substrate of an electro-optic panel to a second substrate. The first light-transmissive plate is smaller than the first substrate, and an end portion of the first substrate is exposed from the first light-transmissive plate. In addition, a heat radiation member made of a metal material is provided so as to be overlapped with the exposed portion from the first light-transmissive plate of the first substrate.