Electro-optic Device Package With Integrated Substrate Housing
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Solution Overview
Problem
Existing electro-optic device packaging is often over-engineered, leading to increased complexity and costs without necessarily enhancing performance, particularly due to the need for precise thermal expansion control and environmental protection, which complicates the packaging of photonic devices.
Innovation Solution
The electro-optic device package design incorporates a multi-level printed circuit board (PCB) as both the substrate and housing, with the electro-optic element flip-chip bonded to it, eliminating the need for additional packaging materials and allowing direct electrical testing before final assembly, thus simplifying the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hermetic housings and complex packaging materials are used to protect against environmental conditions, then reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The housing and substrate are merged into a single integrated structure where the substrate serves dual functions as both the mounting platform for the electro-optic device and the housing that provides environmental protection. This eliminates the need for separate hermetic housing components while maintaining protection against environmental conditions.
Solution Approach 2:
The substrate is designed to perform multiple functions simultaneously: it serves as the mounting substrate for the electro-optic device, provides structural support, and acts as the protective housing. This multi-functionality reduces the overall number of components needed in the package.
2Reliability
If traditional separate housing and substrate design is used, then environmental protection is ensured, but manufacturing cost and complexity increase
Solution Approach 1:
The housing and substrate are combined into a single integrated component, eliminating the need for separate manufacturing and assembly processes for these two elements. This reduces manufacturing steps, material costs, and assembly complexity while maintaining environmental protection capabilities.
3Reliability
If encapsulants are used to seal the device, then environmental protection is improved, but high-frequency performance deteriorates
Solution Approach 1:
The harmful encapsulant material is removed from the design by using the substrate-housing integration approach. The sealed cavity is formed by the physical structure of the integrated substrate-housing assembly rather than by filling with encapsulant material, thereby eliminating the negative impact on high-frequency performance while maintaining environmental protection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces packaging complexity and costs while maintaining performance by utilizing a laminated resin substrate as the package base, minimizing the use of encapsulants that could degrade high-frequency performance and allowing for efficient optical and electrical connections.
Implementation Method 1
an electro-optic element (11) having an optical waveguide (12) and associated electrodes (13a, 13b) for impressing an electric field on the body of electro-optic material
Implementation Method 2
The electro-optic element is flip-chip bonded to a multi-level printed circuit board
Data Source
Figure 1~2
Figure 3~5
AI summary
A package design for electro-optic devices has been developed in which the substrate (21) supporting the electro-optic element (11) serves also as the base of the device housing (31). The electro-optic element may be flip-chip bonded to the substrate. In a preferred embodiment the substrate (21) is a multi-level wiring board.