Electro-optic Device with Direct PCB Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electro-optic devices for vehicle imager modules are costly and complex due to the need for wires or connectors to connect printed circuit boards to electrodes, and they are difficult to compactify when the circuit board is mounted behind the device.
Innovation Solution
An electro-optic device with a printed circuit board mounted directly to an extended portion of a transparent substrate, eliminating the need for wires or connectors by using electrical contacts on the substrate and a third transparent electrode isolated from the first, which is electrically coupled to the second transparent electrode through a conductive seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wires or connectors are used to connect printed circuit boards to electrodes, then electrical connection is achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent merges the printed circuit board with the transparent substrate by mounting the PCB directly to the extended portion of the substrate. This integration eliminates the need for separate wires or connectors to bridge the electrode and the circuit board, as the electrode extends directly to the PCB contact points. The merging of these components reduces device complexity while maintaining reliable electrical connection.
2Reliability
If wires or connectors are used to connect printed circuit boards to electrodes, then electrical connection is achieved, but manufacturing cost increases
Solution Approach 1:
The patent merges the printed circuit board with the transparent substrate by mounting the PCB directly to the extended portion of the substrate. This integration eliminates the need for separate wires or connectors to bridge the electrode and the circuit board, as the electrode extends directly to the PCB contact points. The merging of these components merges these components reduces manufacturing cost.
3Reliability
If the circuit board is mounted behind the device, then electrical connection is achieved, but device compactness deteriorates
Solution Approach 1:
The patent utilizes the extended portion of the transparent substrate that protrudes beyond the edge of the second substrate. By mounting the PCB on this extended portion, the circuit board is positioned in a different spatial dimension - extending laterally rather than being stacked behind the main device body. This dimensional arrangement maintains electrical connection while improving device compactness by eliminating the need for deep rear mounting space.
Data Source
AI summary
An electro-optic device is provided having a first transparent substrate having a first surface and a second surface opposite the first surface; a first transparent electrode on the second surface of the first substrate; a second transparent substrate having a first surface and a second surface opposite the first surface; a second transparent electrode on the first surface of the second substrate, wherein the second substrate is positioned in spaced relation to the first substrate, wherein an extended portion of the first substrate extends beyond an edge of the second substrate; an electro-optic medium disposed between the first substrate and the second substrate, wherein the electro-optic medium is electrically coupled to the first electrode and the second electrode; and a printed circuit board mounted directly to the extended portion of the first substrate, the printed circuit board having a first electrical contact electrically coupled to the first electrode.