Electro-optic Device Ultrasonic Solder Bus Interconnection
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Solution Overview
Problem
Electro-optic assemblies in vehicular and building applications face challenges due to high costs and complex interconnections between electrodes and circuitry, which affect aesthetics and functionality.
Innovation Solution
An electro-optic assembly design featuring a transparent substrate with electrically conductive layers, isolation areas, and a primary seal defining a hermetic cavity, using electrically conductive solder on peripheral edges for connections, eliminating the need for conductive epoxies and reducing material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional conductive epoxies and electrical contacts are used for interconnections, then electrical connectivity is achieved, but material costs and processing complexity increase
Solution Approach 1:
The patent combines the sealing function and electrical interconnection function into a single integrated structure. The conductive solder serves dual purposes: it provides hermetic sealing between the electro-optic assembly and the circuit board, and simultaneously establishes electrical connectivity between the electro-optic electrodes and the circuit board traces, eliminating the need for separate conductive epoxies and electrical contacts
Solution Approach 2:
The conductive solder bus structure performs multiple functions simultaneously: it acts as an electrical conductor, a hermetic seal, and a mechanical bonding element. This multi-functional approach replaces traditional multi-component interconnection systems, reducing both material costs and processing complexity while maintaining reliable electrical connectivity
2Reliability
If traditional interconnection methods with electrical contacts are used, then electrical connectivity is established, but aesthetic appearance deteriorates due to visible interconnections
Solution Approach 1:
The patent extracts the electrical contact elements from the visible face of the electro-optic assembly. By routing electrical connections through the conductive solder bus located at the periphery or edges of the assembly, the design eliminates visible electrical contacts from the main viewing area, thereby improving aesthetic appearance while maintaining electrical connectivity through the integrated solder structure
3Reliability
If complex interconnection structures are used, then electrical connectivity is ensured, but processing costs increase
Solution Approach 1:
The patent merges the sealing process and electrical interconnection process into a single manufacturing step. The conductive solder is applied and reflowed in one operation that simultaneously achieves hermetic sealing and electrical connectivity, eliminating the need for separate application and bonding steps required by traditional conductive epoxies and electrical contacts, thereby reducing processing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces material and processing costs, enhances aesthetics by minimizing visible interconnections, and improves functionality by eliminating the need for electrical contacts and clips, while maintaining durable and efficient electrical communication.
Implementation Method 1
heating the solder to a melting point of the solder
Implementation Method 2
heating the solder to a melting point of the solder
Implementation Method 3
applying an ultrasonic vibration to the solder
Data Source
AI summary
An electro-optic assembly is provided that includes a first substantially transparent substrate comprising: a first surface, a second surface, and a first peripheral edge, the second surface comprises a first electrically conductive layer and a first isolation area. The assembly further includes a second substrate comprising: a third surface, a fourth surface, and a second peripheral edge, the third surface comprises a second electrically conductive layer. The assembly also includes a primary seal between the second and third surfaces, wherein the seal and the second and third surfaces define a substantially hermetic cavity; an electro-optic medium at least partially disposed in the cavity; and an electrically conductive solder that is disposed on at least portions of at least one of the first and second peripheral edges in electrical contact with one of the first and second electrically conductive layers.