Electro-Optical Circuit Board for Photonic Integrated Circuit Testing

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current methods for testing photonic integrated circuits (PICs) are time-consuming and costly due to the need for precise alignment of light-guiding fibers, which limits their applicability for high-volume testing, especially when PICs include both optical and electrical components.

Innovation Solution

An electro-optical circuit board (EOCB) with both electrical and optical contact capabilities, featuring electrical conductor tracks and optical beam paths that can be adapted to the topography of PICs, allowing for simultaneous electrical and optical signal transmission and reception, thereby simplifying and accelerating the testing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If light-guiding fibres are aligned and positioned with respect to the PIC to be tested, then optical contact is achieved, but the positioning takes comparatively long time and requires high accuracy of less than 1 μm

Engineering Contradiction:
Improvepositioning accuracyVSAvoidtest time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The patent applies preliminary action by pre-positioning the optical beam path and electrical conductor tracks on the circuit board before testing. The optical beam path is configured to contact the optical interface of the PIC, and the electrical conductor tracks are arranged to contact electrical interfaces, all in advance according to the PIC topography. This eliminates the need for time-consuming alignment during actual testing, as the positioning is prepared beforehand.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces an intermediary circuit board that mediates between the test equipment and the PIC. The circuit board includes optical beam paths and electrical conductor tracks that serve as intermediaries to contact the PIC's optical and electrical interfaces. This intermediary structure enables automated testing without requiring direct manual alignment of light-guiding fibres with the PIC during testing.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If sequential electrical and optical test processes are used, then comprehensive testing is achieved, but the test process is time-consuming and complex

Engineering Contradiction:
Improvetesting completenessVSAvoidtest throughput
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent merges electrical and optical testing functions into a single integrated circuit board. The circuit board simultaneously provides electrical conductor tracks for electrical contact and optical beam paths for optical contact, allowing both types of testing to be performed together rather than sequentially. This combination maintains comprehensive testing capability while significantly reducing test time and increasing throughput.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The circuit board is designed with multi-functionality, serving both as an electrical contact interface and an optical contact interface for PIC testing. The board can contact both electrical interfaces and optical interfaces of the PIC, making it a universal testing platform that eliminates the need for separate electrical and optical test equipment and processes.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Manufacturing precision

If the circuit board is adapted to the topography of PICs, then contact precision is improved, but the device complexity increases

Engineering Contradiction:
Improvecontact precisionVSAvoidcircuit board complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by configuring the optical beam path and electrical conductor tracks according to the specific topography of the PIC at different locations. The circuit board is adapted to contact the optical interface and electrical interfaces at their respective positions on the PIC, providing precise local contact without requiring the entire board to be overly complex. Each region of the board is optimized for its specific contact function.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The EOCB enables efficient and rapid testing of both electrical and optical functionalities of PICs, reducing test time and increasing throughput by allowing for automated and precise contact without the need for sequential electrical and optical test processes.

Implementation Method 1

The optical beam path can guide a light beam

Methodology Applied
Scientific EffectLight guidance: Optical Fibre

Data Source

PatentUS11946950B2Electro-optical circuit board for contacting photonic integrated circuits
Publication Date: 2024.04.02 CARL ZEISS SMT GMBH
  • US11946950B2 patent drawing
  • US11946950B2 patent drawing
  • US11946950B2 patent drawing

AI summary

An electro-optical circuit board can provide probe card functionality. The electro-optical circuit board includes at least one electrical conductor track and at least one optical beam path.