Electro-Optical Dual-Dielectric Substrate for High-Temperature Reliability
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Solution Overview
Problem
Existing composite substrates for electro-optical elements face issues such as peeling, high light propagation loss, and difficulty in achieving high-speed and low-voltage drive, particularly when used under severe high-temperature environments.
Innovation Solution
A composite substrate design involving two high dielectric layers directly joined to integrate an electro-optical crystal substrate and a support substrate, with controlled argon concentrations and thicknesses, forming an amorphous layer between them to prevent peeling and maintain reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electro-optical crystal substrate and the thin film layer are directly joined to each other, then the integration is achieved, but light propagation loss occurs
Solution Approach 1:
The patent introduces a buffer layer as an intermediary between the electro-optical crystal substrate and the thin film layer. This buffer layer has specific properties (thickness of 1-100 nm, composed of materials like SiO2, Si3N4, or Ta2O5) that enable effective stress compensation and optical matching, thereby reducing light propagation loss while maintaining integration reliability.
2Reliability
If the thin film layer and the support substrate are directly joined to each other, then the integration is achieved, but high-speed drive becomes difficult
Solution Approach 1:
The buffer layer serves as an intermediary that improves the electrical interface between the thin film layer and support substrate. By optimizing the buffer layer's material composition and thickness, the patent achieves effective stress compensation and improved electrical contact, enabling high-speed drive while maintaining integration reliability.
3Reliability
If the thin film layer and the support substrate are directly joined to each other, then the integration is achieved, but joining success rate decreases
Solution Approach 1:
The buffer layer acts as a mediator that facilitates successful joining between the thin film layer and support substrate. By providing stress compensation and improved surface matching, the buffer layer increases the joining success rate while maintaining integration reliability.
4Volume of moving object
If the electro-optical crystal substrate is made extremely thin, then the element footprint is reduced, but peeling occurs under high-temperature conditions
Solution Approach 1:
The buffer layer serves as a stress-compensating intermediary that prevents peeling of the extremely thin electro-optical crystal substrate under high-temperature conditions. By optimizing the buffer layer's material properties and thickness, the patent maintains substrate integrity while achieving reduced footprint.
Solution Approach 2:
The patent optimizes the buffer layer's thickness parameter (1-100 nm) and material composition to achieve the best balance between stress compensation and optical performance. This parameter optimization prevents peeling while maintaining the extremely thin substrate configuration.
5Device complexity
If a single high dielectric layer is used, then the structure is simple, but peeling and light propagation loss occur
Solution Approach 1:
The patent segments the high dielectric layer into two separate high dielectric layers with specific thicknesses and material compositions. This segmentation allows for better stress distribution and reduced optical loss, thereby improving peeling resistance while maintaining reasonable structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly suppresses peeling, reduces light propagation loss, and enables high-speed and low-voltage drive, even under severe high-temperature conditions, while maintaining excellent reliability.
Implementation Method 1
The first high dielectric layer and the second high dielectric layer are directly joined to each other, and an amorphous layer is formed at a joining interface between the first high dielectric layer and the second high dielectric layer
Data Source
AI summary
There is provided a composite substrate in which peeling is significantly suppressed, light propagation loss is small when used as an electro-optical element, and high-speed and low-voltage drive is possible, and which can achieve an extremely thin electro-optical element capable of maintaining excellent reliability even under a severe high-temperature environment. A composite substrate for an electro-optical element according to an embodiment of the present invention includes: an electro-optical crystal substrate having an electro-optical effect; a first high dielectric layer; a second high dielectric layer; and a support substrate in the stated order. The first high dielectric layer and the second high dielectric layer are directly joined to each other, and an amorphous layer is formed at a joining interface between the first high dielectric layer and the second high dielectric layer.