Electro-optical Device Heat Dissipation Plate Assembly
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Solution Overview
Problem
Existing electro-optical devices face challenges with heat dissipation, particularly in high-definition systems, where the labor-intensive assembly of overlapping mounting substrates within a heat dissipation member reduces heat dissipation efficiency and increases the risk of heat-related issues affecting display quality and reliability.
Innovation Solution
The electro-optical device incorporates a holder with separate first and second heat dissipation plate portions that overlap the drive ICs from both sides, allowing efficient heat escape without requiring the substrates to pass between them, thus simplifying assembly and enhancing heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If mounting substrates are made to pass through the inside of a rectangular cylindrical heat dissipation member, then heat dissipation from the drive IC is improved, but the assembly process becomes labor-intensive and time-consuming
Solution Approach 1:
The heat dissipation structure is divided into multiple independent heat dissipation members (first heat dissipation member and second heat dissipation member) that can be separately formed and assembled. This segmentation allows the substrates to be assembled first, then the heat dissipation members are attached to the drive IC, eliminating the need for substrates to pass through a complex cylindrical structure during assembly.
Solution Approach 2:
The heat dissipation members are pre-formed as separate components before the final assembly step. The substrates are assembled onto the electro-optical panel first, and then the pre-formed heat dissipation members are attached to the drive ICs. This preliminary preparation simplifies the overall assembly process and improves productivity.
2Ease of manufacture
If sufficient space is provided between mounting substrates and heat dissipation member, then assembly is simplified, but heat dissipation performance is reduced
Solution Approach 1:
The heat dissipation members are designed with localized thermal conduction paths that are in direct contact with the drive ICs. The members are positioned to overlap with the drive IC mounting areas, creating concentrated heat dissipation zones without requiring large gaps. This local quality approach maintains good thermal contact while simplifying assembly.
Solution Approach 2:
The heat dissipation members extend in the thickness direction (z-direction) of the electro-optical panel, overlapping with the drive ICs from both sides. This three-dimensional configuration allows heat dissipation without requiring lateral space between substrates and heat dissipation components, as the heat dissipation path is established through vertical overlap rather than horizontal clearance.
3Manufacturing precision
If multiple mounting substrates are assembled in an overlapped state, then high definition and miniaturization are achieved, but heat dissipation becomes more difficult
Solution Approach 1:
The heat dissipation members are designed to serve multiple functions: they provide mechanical support for the drive ICs, enable heat dissipation from multiple substrates simultaneously, and maintain the overlapped configuration necessary for high definition. Each heat dissipation member can accommodate multiple drive ICs located at different positions on the substrates, making the solution universally applicable to various substrate arrangements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient heat dissipation, reduces labor in assembly, and maintains high definition and reliability while minimizing the need for wide gaps between substrates and heat dissipation components, resulting in a compact and reliable electro-optical device.
Implementation Method 1
a first heat dissipation plate portion 73...a second heat dissipation plate portion 74...heat generated by the drive IC can efficiently escape through the first heat dissipation plate portion 73 and the second heat dissipation plate portion 74
Data Source
AI summary
An electro-optical device includes a plurality of mounting substrates connected to an electro-optical panel. A holder includes a first holder member and a second holder member that support an electro-optical panel from both sides. In addition, a holder includes a first heat dissipation plate portion and a second heat dissipation plate portion on both sides of a part where a first drive IC and a second drive IC are mounted, among a part where a plurality of mounting substrates overlap each other and extend. A second heat dissipation plate portion is configured integrally with a second holder member, and a first heat dissipation plate portion is configured separately from a first holder member and a second heat dissipation plate portion and is fixed to a second heat dissipation plate portion by a fixing unit such as a fixing member or the like.