Electro-Optical Interconnect Platform with Beam Couplers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current optical coupling techniques for photonic integrated circuits (PICs) face challenges such as poor alignment tolerance, signal losses, and complex assembly processes, making mass production of PICs and optical couplers inefficient and costly.
Innovation Solution
An electro-optical interconnection platform with a passive interposer and optical pads, including beam couplers formed as curved or tilted mirrors, allows for relaxed alignment tolerances and efficient optical connectivity through standard packaging machinery, enabling high-volume production.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional butt connection or angled tip techniques are used to couple optical fibers to PICs, then optical connectivity is achieved, but alignment tolerance becomes extremely tight (1-2 microns) and assembly complexity increases
Solution Approach 1:
The patent introduces an intermediary optical element (lens or mirror) between the optical fiber and the PIC waveguide. This intermediary component transforms the coupling geometry, allowing the fiber to be positioned at a distance from the waveguide while still achieving efficient optical coupling. The intermediary element acts as a mediator that relaxes the tight alignment constraints of direct coupling methods.
Solution Approach 2:
The patent transitions from planar 2D alignment (direct fiber-to-waveguide coupling) to 3D spatial arrangement by positioning the fiber above the waveguide at a controlled distance. This dimensional change allows the use of lenses or mirrors to focus or redirect light, thereby relaxing lateral alignment tolerances while maintaining optical coupling efficiency.
2Reliability
If active positioning equipment is used to achieve precise fiber alignment, then connectivity efficiency improves, but production cost and device complexity increase
Solution Approach 1:
The patent incorporates alignment features directly into the PIC substrate during fabrication, such as recesses, protrusions, or registered holes that mechanically guide and pre-position the optical fiber or lens. This preliminary action eliminates the need for complex active positioning equipment during assembly, as the alignment is built-in from the start.
Solution Approach 2:
The PIC substrate is designed with self-aligning features that automatically position the optical fiber or lens correctly during assembly. The mechanical structures (recesses, protrusions) cause the components to self-align without requiring external positioning equipment, making the system self-servicing in terms of alignment.
3Loss of energy
If tight alignment tolerances are maintained for efficient optical coupling, then signal loss is reduced, but mass production becomes infeasible
Solution Approach 1:
The intermediary lens or mirror creates a larger effective coupling area and provides a degree of freedom in positioning. This allows mass production processes to use less precise assembly methods while still achieving low signal loss, thereby enabling feasible mass production of optically coupled PICs.
Solution Approach 2:
Alignment features are pre-integrated into the PIC substrate during fabrication, ensuring that subsequent assembly steps do not require high-precision positioning. This preliminary preparation of alignment structures enables standard mass production techniques to be used while maintaining efficient optical coupling and low signal loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The platform achieves low signal losses and thermal stability, enabling efficient interconnection of electronic and photonic components with standard die stacking processes, facilitating mass production of PICs and optical couplers.
Implementation Method 1
The angled tip has a flat surface which reflects a light beam down to a waveguide grating coupler disposed on the integrated circuit. The light beam is reflected off the reflective surface of the angled tip by total internal reflection.
Data Source
AI summary
An electro-optical interconnection platform is provided. The platform includes an interface medium; a plurality of optical pads; a plurality of electrical pads; and at least one beam coupler adapted to optically couple at least one pair of optical pads of the plurality of optical pads, wherein the at least one pair of optical pads are placed on opposite sides of the interface medium.