Electro-Optical Memory Package With Stacked PIC Access
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Solution Overview
Problem
Existing integrated circuits, particularly those for artificial intelligence and machine learning, face challenges in scaling data movement between processor ICs and memory ICs due to inadequate advancements in data transfer components, which cannot keep pace with the increasing demand for faster and more efficient data processing.
Innovation Solution
The implementation of electro-photonic circuit packages with stacked memory resources directly accessible by EIC dies, utilizing optical regions and photonic interfaces for direct data transfer, enabling efficient data access and communication between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If traditional electrical interconnects are used for data transfer between processor ICs and memory ICs, then the system can maintain simple electrical connections, but the data transfer speed and efficiency cannot keep pace with increasing processing demands
Solution Approach 1:
The patent replaces traditional electrical interconnects with optical interconnects using photonic integrated circuits (PICs). Light-based communication substitutes for electrical signals, enabling faster data transfer between processor ICs and memory ICs while overcoming the bandwidth limitations of electrical interconnects.
Solution Approach 2:
The patent implements three-dimensional stacking architecture where processor ICs and memory ICs are vertically stacked with PICs positioned between them. This vertical arrangement in the third dimension enables direct optical coupling and reduces the physical distance for data transfer, significantly improving speed and efficiency.
2Productivity
If data transfer components are advanced to meet higher speeds, then data transfer efficiency improves, but the complexity of the interconnect architecture increases beyond current scaling capabilities
Solution Approach 1:
The patent merges electrical and optical interconnect functions into a unified architecture. Electrical interconnects handle control signals and power, while optical interconnects handle high-bandwidth data transfer. This consolidation achieves high productivity without requiring completely separate complex systems.
Solution Approach 2:
Photonic integrated circuits serve as intermediary components between processor ICs and memory ICs. The PICs convert electrical signals to optical signals for high-speed data transfer and back to electrical signals for processing, enabling efficient data movement without direct electrical connections between distant ICs.
3Speed
If optical interconnects are implemented for high-speed data transfer, then data movement efficiency increases, but the packaging and integration complexity increases
Solution Approach 1:
Photonic integrated circuits are pre-fabricated and tested as complete functional units before being integrated into the final stacked package. This preliminary preparation simplifies the packaging process by reducing on-site assembly complexity and ensuring optical alignment is established during PIC manufacturing rather than during final integration.
Solution Approach 2:
The patent implements a nested stacking architecture where PICs are positioned within the vertical stack between processor ICs and memory ICs. The optical components are nested within the package structure, with optical pathways routed through the vertical arrangement, enabling compact integration while maintaining high-speed data transfer capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances data transfer efficiency by allowing direct access to memory stacks via optical regions, facilitating faster and more robust communication within limited space constraints, thereby supporting the growing demand for data processing in integrated circuits.
Implementation Method 1
an optical portion stacked below the first die, the optical portion being configured to, in cooperation with the electrical portion, transform instructions from an optical signal to an electrical signal when receiving or transform instructions from an electrical signal to an optical signal when transmitting
Implementation Method 2
an optical region on a top surface of the second die, the optical region not intersecting with the first die, the optical region being configured to allow an optical signal to pass through to facilitate communication with another device
Data Source
AI summary
The present disclosure relates to packaging techniques in connection with packaging electrical and optical components within circuit packages. For example, one or more examples described herein involve producing or manufacturing memory circuit packages having memory stacks positioned on top of electronic integrated (EIC) dies positioned over one or more PIC wafers. Techniques described herein also relate to forming overmolded memory circuit packages having optical interfaces which are optically accessible via optical window(s).