Electro-Optical Device Thermal Management via Metal Frame Conduction

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Solution Overview

Problem

Existing electro-optical devices face challenges in effectively suppressing temperature rise due to inadequate heat dissipation, leading to potential malfunctions and reduced lifespan, despite efforts to increase thermal radiation properties.

Innovation Solution

Incorporating a first metal portion in contact with both the light-transmitting cover and the element substrate, and optionally a second metal portion, to enhance heat release through the substrate, with configurations including frame shapes and adhesive layers for efficient thermal conduction.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If the light-transmitting cover is used to transmit light to the mirrors, then light transmission efficiency is improved, but temperature rise occurs due to absorbed light energy

Engineering Contradiction:
Improvelight transmission efficiencyVSAvoidtemperature rise of light-transmitting cover
Core Design Contradiction:
Illumination intensityVSTemperature

Solution Approach 1:

The patent converts the harmful heat energy absorbed by the light-transmitting cover into beneficial thermal conduction by introducing a metal frame that conducts this heat to the element substrate, which then dissipates it through the sealing resin to the external environment, thus converting the harmful temperature rise into an effective heat management solution

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces a metal frame as an intermediary thermal conduction path between the light-transmitting cover and the element substrate, and the sealing resin as a secondary intermediary that conducts heat from the element substrate to the external environment, creating a multi-stage heat transfer pathway that effectively manages the temperature rise

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If sealing resin is used to seal the element substrate, then sealing and moisture prevention are improved, but heat transmission efficiency remains insufficient

Engineering Contradiction:
Improvesealing performanceVSAvoidheat transmission efficiency
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent creates a composite thermal management system that combines the sealing function of the sealing resin with the high thermal conductivity of the metal frame, forming a hybrid structure where the metal frame provides efficient heat conduction while the sealing resin provides both sealing and supplementary heat transmission pathways

Inventive Principle:
Principle #40Composite materials

3Temperature

If the contact area between the device and sealing resin is increased, then heat transmission to sealing resin is improved, but the low transmission efficiency of sealing resin limits sufficient temperature suppression

Engineering Contradiction:
Improveheat transmission to sealing resinVSAvoidtemperature suppression effectiveness
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent segments the heat transmission pathway into two distinct stages: first, the metal frame conducts heat from the light-transmitting cover to the element substrate; second, the sealing resin conducts heat from the element substrate to the external environment. This segmentation allows each component to be optimized for its specific function, compensating for the low thermal conductivity of the sealing resin through the high conductivity of the metal frame

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach effectively suppresses temperature rise, preventing malfunctions and extending the lifespan of electro-optical devices by improving heat dissipation, while also preventing moisture infiltration through the use of sealing resins and inorganic material layers.

Implementation Method 1

a first metal portion in contact with the element substrate and the light-transmitting cover

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

as a method of increasing the thermal radiation properties of a device mounted on a substrate

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS10156779B2Electro-optical device, method of manufacturing electro-optical device, and electronic apparatus
Publication Date: 2018.12.18 SEIKO EPSON CORP
  • US10156779B2 patent drawing
  • US10156779B2 patent drawing
  • US10156779B2 patent drawing

AI summary

In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.