Electro-Optical Device Thermal Management via Metal Frame Conduction
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Solution Overview
Problem
Existing electro-optical devices face challenges in effectively suppressing temperature rise due to inadequate heat dissipation, leading to potential malfunctions and reduced lifespan, despite efforts to increase thermal radiation properties.
Innovation Solution
Incorporating a first metal portion in contact with both the light-transmitting cover and the element substrate, and optionally a second metal portion, to enhance heat release through the substrate, with configurations including frame shapes and adhesive layers for efficient thermal conduction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the light-transmitting cover is used to transmit light to the mirrors, then light transmission efficiency is improved, but temperature rise occurs due to absorbed light energy
Solution Approach 1:
The patent converts the harmful heat energy absorbed by the light-transmitting cover into beneficial thermal conduction by introducing a metal frame that conducts this heat to the element substrate, which then dissipates it through the sealing resin to the external environment, thus converting the harmful temperature rise into an effective heat management solution
Solution Approach 2:
The patent introduces a metal frame as an intermediary thermal conduction path between the light-transmitting cover and the element substrate, and the sealing resin as a secondary intermediary that conducts heat from the element substrate to the external environment, creating a multi-stage heat transfer pathway that effectively manages the temperature rise
2Reliability
If sealing resin is used to seal the element substrate, then sealing and moisture prevention are improved, but heat transmission efficiency remains insufficient
Solution Approach 1:
The patent creates a composite thermal management system that combines the sealing function of the sealing resin with the high thermal conductivity of the metal frame, forming a hybrid structure where the metal frame provides efficient heat conduction while the sealing resin provides both sealing and supplementary heat transmission pathways
3Temperature
If the contact area between the device and sealing resin is increased, then heat transmission to sealing resin is improved, but the low transmission efficiency of sealing resin limits sufficient temperature suppression
Solution Approach 1:
The patent segments the heat transmission pathway into two distinct stages: first, the metal frame conducts heat from the light-transmitting cover to the element substrate; second, the sealing resin conducts heat from the element substrate to the external environment. This segmentation allows each component to be optimized for its specific function, compensating for the low thermal conductivity of the sealing resin through the high conductivity of the metal frame
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses temperature rise, preventing malfunctions and extending the lifespan of electro-optical devices by improving heat dissipation, while also preventing moisture infiltration through the use of sealing resins and inorganic material layers.
Implementation Method 1
a first metal portion in contact with the element substrate and the light-transmitting cover
Implementation Method 2
as a method of increasing the thermal radiation properties of a device mounted on a substrate
Data Source
AI summary
In an electro-optical device, a light-transmitting cover is disposed in mirrors, and when light is applied toward the mirrors through the light-transmitting cover, the temperature of the light-transmitting cover tires to increase due to the applied light. Here, in the electro-optical device, first metal portions that are in contact with the light-transmitting cover and the element substrate are formed. For this reason, it is possible to release the heat of the light-transmitting cover to a substrate through the first metal portions and the element substrate.


