Electro-Optical IC Package Using Embedded Bridges for Dense Links
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Solution Overview
Problem
Current integrated circuit packages face challenges in optimizing power consumption and bandwidth density due to inefficient interconnects between the integrated circuit die and optical module, particularly in high-performance computing systems that require high bandwidth communication.
Innovation Solution
A multichip package configuration that integrates a main integrated circuit die with an electro-optical tile, including a transceiver and optical engine, directly connected via embedded multi-die interconnect bridges, which reduces power consumption and enhances interconnect density while supporting high bandwidth speeds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If package traces on printed circuit board are used to connect integrated circuit die to optical module, then data transfer is enabled, but power dissipation increases significantly
Solution Approach 1:
The patent combines the integrated circuit die and optical module into a single integrated circuit package, eliminating the need for external package traces on a printed circuit board. The transceiver and optical engine are integrated within the same package, directly connecting the die to the optical interface without requiring long external interconnect traces, thereby reducing power dissipation.
Solution Approach 2:
The patent segments the system into distinct functional components (processing circuitry, transceiver, optical engine) that are integrated within a single package. This segmentation allows optimized interconnect paths between components, reducing the length and power consumption of signal traces compared to external board-level connections.
2Productivity
If external optical module with package traces is used, then optical communication is achieved, but interconnect density is reduced
Solution Approach 1:
The patent merges the transceiver and optical engine into a single integrated package with the processing die, enabling high-density interconnects within the package. This integration allows multiple high-bandwidth channels to be packed into a compact form factor, achieving superior bandwidth density compared to external module connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces power dissipation while maintaining high interconnect speeds, enabling efficient data transfer and supporting bandwidths exceeding 10 Gbps, 40 Gbps, 100 Gbps, and 400 Gbps, thereby addressing the limitations of existing technologies.
Implementation Method 1
an optical engine formed on the package substrate, wherein the optical engine is configured to interface directly with an optical cable
Implementation Method 2
a transceiver formed on the package substrate
Data Source
AI summary
A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.