Electro-Optical IC Package Layout for Low-Power High-Bandwidth Links
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Solution Overview
Problem
Current integrated circuit packages face challenges in optimizing power consumption and bandwidth density due to inefficient interconnects between the integrated circuit die and optical module, particularly in high-performance computing systems that require high bandwidth communication.
Innovation Solution
A multichip package configuration that integrates a main integrated circuit die with an electro-optical tile, including a transceiver and optical engine, which eliminates conventional chip-to-module interconnects, utilizing embedded multi-die interconnect bridges (EMIBs) and microbumps for reduced power consumption and increased bandwidth density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional chip-to-module interconnects are used, then ease of manufacture is improved, but power dissipation increases significantly
Solution Approach 1:
The patent merges the optical module functionality directly onto the integrated circuit die by forming the optical engine, transceiver, and interconnect circuitry as a single integrated structure. This eliminates the separate chip-to-module interconnect path and reduces the number of discrete components, thereby reducing power dissipation while maintaining manufacturability through standard semiconductor fabrication processes.
Solution Approach 2:
The patent extracts the optical engine and transceiver functions from a separate optical module and integrates them directly onto the IC die. This removal of the external optical module eliminates the need for high-power package traces, significantly reducing power dissipation while the integrated structure remains manufacturable using existing semiconductor manufacturing capabilities.
2Productivity
If package traces on printed circuit board are used for high bandwidth communication, then bandwidth is improved, but power dissipation increases
Solution Approach 1:
The patent combines the high-bandwidth interconnect function with the optical engine functionality into an integrated structure on the IC die. The interconnect circuitry is formed directly adjacent to the optical engine, enabling high-bandwidth communication (10 Gbps, 40 Gbps, 100 Gbps, or 400 Gbps) through short, low-power traces within the integrated structure rather than through high-power package traces on the printed circuit board.
3Adaptability or versatility
If external optical module with cable connection is used, then adaptability is improved, but device complexity increases
Solution Approach 1:
The patent merges the optical module functionality (optical engine, transceiver, and interconnect) directly onto the IC die as a single integrated structure. This integration eliminates the need for separate optical modules and external cable connections, reducing device complexity while maintaining the adaptability to support multiple bandwidth rates (10, 40, 100, or 400 Gbps) through software or configuration controls.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces power dissipation while maintaining high interconnect speeds, supporting bandwidths exceeding 10 Gbps, 40 Gbps, 100 Gbps, and 400 Gbps, thereby enhancing the efficiency of high-performance computing systems.
Implementation Method 1
an optical engine formed on the second substrate, wherein the optical engine is configured to interface directly with the optical cable
Implementation Method 2
a transceiver formed on the second substrate, wherein the transceiver is coupled between the processing circuitry and the optical engine
Data Source
AI summary
A multichip package may include at least a package substrate, a main die mounted on the package substrate, a transceiver die mounted on the package substrate, and an optical engine die mounted on the package substrate. The main die may communicate with the transceiver die via a first high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die may communicate with the optical engine die via a second high-bandwidth interconnect bridge embedded in the package substrate. The transceiver die has physical-layer circuits that directly drive the optical engine. An optical cable can be connected directly to the optical engine of the multichip package.