Electro-Optical Package Thermal Management via 3D Stacking
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Solution Overview
Problem
Designing compact and cost-effective electro-optical packages that integrate electronic circuits with optical systems for high-speed operations and thermal management is challenging due to alignment, thermal, and cost considerations.
Innovation Solution
A system comprising an electro-optical chip coupled with an array of optical fibers through an optical interposer chip, a physical medium dependent integrated circuit, and redistribution layers, with an overmold encapsulating the integrated circuit and via core, and a socket with conductive paths for efficient electrical and thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electro-optical components are integrated in a compact package, then space efficiency and cost are improved, but thermal management and alignment precision deteriorate
Solution Approach 1:
The package is divided into distinct functional layers: optical interposer chip for alignment, electro-optical chip for active components, and heat sink for thermal management. This segmentation allows each component to be optimized independently while maintaining compact overall dimensions.
Solution Approach 2:
The patent transitions from planar integration to three-dimensional stacking, with components arranged in vertical layers. This dimensional change enables compact footprint while providing dedicated thermal pathways through the vertical structure, resolving the conflict between small size and thermal management.
2Volume of moving object
If electro-optical components are integrated in a compact package, then space efficiency and cost are improved, but alignment precision deteriorates
Solution Approach 1:
The optical interposer chip is fabricated with pre-formed V-grooves that passively align optical fibers before final assembly. This preliminary alignment structure eliminates the need for complex active alignment processes, maintaining high precision while enabling compact integration.
Solution Approach 2:
The optical interposer chip serves as an intermediary component between the electro-optical chip and optical fibers. It provides a stable reference frame with precision-machined V-grooves that mediate the alignment process, ensuring sub-micron precision even in compact packages.
3Adaptability or versatility
If conductive paths are extended for electrical connection, then connectivity is improved, but signal loss and thermal resistance increase
Solution Approach 1:
Multiple parallel conductive paths are created through the substrate, providing redundant pathways for electrical signals and thermal conduction. This multiplication of paths reduces resistance and signal loss while maintaining design flexibility for various connectivity configurations.
Data Source
AI summary
An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.