Electro-optical Device Recessed Capacitance Light Shielding
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Solution Overview
Problem
Conventional electro-optical devices face challenges in suppressing the lowering of numerical aperture while increasing capacitance value, leading to compromised display quality due to complex light shielding configurations that can destabilize transistor operations.
Innovation Solution
The electro-optical device incorporates a substrate with recessed portions and a laminated film structure, including conductive layers, dielectric layers, and insulating films, where the capacitance elements are disposed below the transistors, allowing for enhanced light shielding and increased capacitance without the need for multiple capacitance elements, thus simplifying the configuration and improving display quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple capacitance elements are provided for each pixel to increase capacitance value, then capacitance value is improved, but device complexity increases and light shielding becomes complicated
Solution Approach 1:
The patent transitions from a planar arrangement of multiple capacitance elements to a three-dimensional structure by forming a recessed portion in the substrate and placing the capacitance element within this recess. This vertical dimensionality change allows a single capacitance element to achieve higher capacitance value without increasing lateral complexity or requiring multiple elements.
Solution Approach 2:
The capacitance element is nested within the recessed portion of the substrate, with the capacitance element's first conductive layer and second conductive layer positioned at different depths within the recess. This nesting structure maximizes the use of vertical space to increase capacitance while maintaining a compact footprint.
2Object-affected harmful factors
If multiple capacitance elements and complex wiring structures are added to shield light from transistors, then light shielding is improved, but numerical aperture decreases and display quality is lowered
Solution Approach 1:
The patent extracts the light shielding function from the capacitance element structure itself by forming the capacitance element within a recessed portion. The recessed portion's side surface and bottom surface naturally shield light from reaching the transistor, eliminating the need for additional light shielding structures that would block light and reduce numerical aperture.
Solution Approach 2:
The recessed portion structure serves multiple functions simultaneously: it increases the capacitance value by providing a vertical stacking arrangement for the capacitance element, and it provides light shielding for the transistor by positioning the capacitance element's conductive layers between the light path and the transistor. This multi-functionality resolves the contradiction between light shielding and numerical aperture.
3Object-affected harmful factors
If capacitance elements and wiring structures are disposed above the transistor to shield light, then light shielding is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
Instead of placing light shielding structures above the transistor as in conventional designs, the patent inverts the approach by forming the capacitance element within a recessed portion that naturally shields the transistor from light. The capacitance element is positioned below the transistor level in the vertical arrangement, reversing the conventional topology.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses light intrusion onto transistors, enhances light shielding, and increases capacitance value, resulting in improved display quality by maintaining numerical aperture and stabilizing transistor operations.
Implementation Method 1
a laminated film disposed along the bottom surface and the side surface of the recessed portion, and having a first conductive layer, a dielectric layer, and a second conductive layer
Implementation Method 2
a light shielding film... wherein the laminated film, the first insulating film, the light shielding film, the second insulating film, and the semiconductor layer are disposed in this order from a substrate side
Data Source
AI summary
An electro-optical device includes: a substrate extending along a first direction and having a recessed portion including a bottom surface and a side surface, a laminated film disposed along the bottom surface and the side surface of the recessed portion, and having a first conductive layer, a dielectric layer, and a second conductive layer, a first insulating film covering the laminated film, a portion of the first insulating film being disposed inside the recessed portion, a light shielding film, a second insulating film, and a semiconductor layer disposed along the first direction. The laminated film is arranged along the bottom surface and the side surface of the recessed portion, the first insulating film is disposed so as to include the recessed portion, and a length of side surface in a depth direction is larger than a length of the bottom surface in a width direction.