Electro-Optical IC Module with Switchable Waveguide
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Solution Overview
Problem
Current technologies face challenges in achieving compact, cost-effective, and efficient integration of photonic and electrical circuits due to the need for discrete chips and increased substrate area, which hinders the realization of dense integrations and direct chip-to-chip connections.
Innovation Solution
The development of an electro-optical integrated circuit (IC) module with a switchable waveguide device that combines photonic and electrical ICs using a Pockel cell architecture, where a nonlinear optical material and electrodes are used to modulate photonic signals, enabling direct bonding and hybrid bonding techniques for finer pitches and reduced processing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If discrete chips are used for photonic and electrical circuits, then functionality is achieved, but substrate area increases and integration density decreases
Solution Approach 1:
The patent merges photonic and electrical circuits into a single integrated photonic-electrical chip structure. The photonic circuit layer is directly bonded to the electrical circuit layer, eliminating the need for separate discrete chips and reducing overall substrate area while maintaining full functionality of both circuit types.
Solution Approach 2:
The patent implements a nested structure where the photonic circuit layer is positioned above and integrated with the electrical circuit layer. This multi-layer nesting approach allows both circuit types to coexist in a compact vertical arrangement, reducing the horizontal substrate footprint while preserving individual circuit functionalities.
2Adaptability or versatility
If discrete chips are used for photonic and electrical circuits, then functionality is achieved, but device complexity and assembly processing increase
Solution Approach 1:
The patent combines photonic and electrical circuits into a single integrated device structure with direct layer-to-layer bonding. This merging eliminates the need for separate assembly processes for multiple discrete chips, reducing overall device complexity and simplifying manufacturing while maintaining complete functionality.
Solution Approach 2:
The patent performs preliminary integration of photonic and electrical circuits during the chip fabrication process itself, creating pre-assembled integrated structures. This preliminary action eliminates subsequent complex assembly steps that would be required if discrete chips were used, reducing overall device complexity.
3Ease of operation
If traditional waveguide switching is used, then photonic signal control is achieved, but high voltage requirements increase energy consumption
Solution Approach 1:
The patent changes the operating voltage parameter of the waveguide switching mechanism from traditional high voltage to low voltage operation. This is achieved through optimized waveguide design and material selection that enables effective optical switching at reduced voltage levels, maintaining ease of operation while significantly decreasing energy consumption.
Solution Approach 2:
The patent replaces traditional high-voltage electrical control mechanisms with an optimized low-voltage waveguide switching mechanism. This substitution maintains the ability to control photonic signals effectively while operating at lower energy levels, reducing overall system energy consumption.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for compact, efficient integration of photonic and electrical circuits, reducing costs and energy consumption while enabling finer feature dimensions and improved assembly processes, thus enhancing data transmission speeds and capacities.
Implementation Method 1
combines photonic and electrical ICs using a Pockel cell architecture, where a nonlinear optical material and electrodes are used to modulate photonic signals
Data Source
AI summary
An integrated circuit (IC) module includes a photonic IC, an electrical IC, and a switchable waveguide device that, using a signal from the electrical IC, controls optical signals to or from the photonic IC. The switchable waveguide device may be formed by coupling metallization structures on both sides of, and either level with or below, a nonlinear optical material. The metallization structures may be in the photonic or electrical IC. The nonlinear optical material may be above the electrical IC in the photonic IC or on a glass substrate. The photonic and electrical ICs may be hybrid bonded or soldered together. The IC module may be coupled to a system substrate.


