Electro-Optical Package Assembly for Short Wire Bond Alignment
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Solution Overview
Problem
In electro-optical packages, significant part-to-part thickness variations hinder the formation of short wire bonds, which are essential for high-bandwidth connections between integrated circuits and other elements.
Innovation Solution
An assembly and method that utilize adjustable bonding layers and spacers to align wire bond pads within a specified height difference, ensuring that wire bonds can be formed with a height difference of less than 100 microns, using bonding agents like epoxy to set and maintain the necessary thicknesses, allowing for the compensation of thickness variations among components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If wire bonds are made short to achieve high bandwidth, then connection bandwidth is improved, but part-to-part thickness variations make it difficult to form such short wire bonds
Solution Approach 1:
A spacer is introduced as an intermediary component between the carrier and the integrated circuits. The spacer provides a reference surface that enables precise positioning of wire bond pads, allowing short wire bonds to be formed despite variations in component thicknesses. The spacer acts as a mediator that decouples the wire bond formation process from the underlying component thickness variations.
Solution Approach 2:
The height of the spacer is specifically designed and adjusted to compensate for part-to-part thickness variations. By changing the spacer height parameter, the system achieves a target height difference of less than 100 microns between wire bond pads, enabling short wire bonds to be formed while accommodating manufacturing tolerances in the integrated circuits and carrier.
2Manufacturing precision
If spacer height is adjusted to compensate for thickness variations, then wire bond pad alignment is improved, but additional fabrication steps are required
Solution Approach 1:
The spacer is prepared in advance with a pre-determined height that accounts for expected thickness variations in the integrated circuits and carrier. This preliminary action of selecting the appropriate spacer height before assembly simplifies the overall fabrication process, as the spacer arrives ready-to-use and eliminates the need for complex height adjustment procedures during assembly.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation of short wire bonds with reduced height differences between pads, facilitating high-bandwidth connections and compensating for part-to-part thickness variations in electro-optical packages.
Implementation Method 1
bonding agents like epoxy to set and maintain the necessary thicknesses
Implementation Method 2
a thermoelectric cooler, on the carrier
Data Source
AI summary
An electro-optical package. In some embodiments, the package includes: a carrier; a first integrated circuit, on the carrier; a first bonding layer, between the carrier and the first integrated circuit; a thermoelectric cooler, on the carrier; a second integrated circuit, on the thermoelectric cooler; and a first wire bond. The first wire bond may connect a first pad, on the first integrated circuit, to a second pad, on the second integrated circuit, the first pad and the second pad having a height difference less than 100 microns.