Electro-optical Device Wiring Substrate Parallel Reinforcing Line
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Solution Overview
Problem
In electro-optical devices, the resistance of wiring lines on flexible substrates connected to glass substrates is high due to long wiring lengths, leading to voltage changes and restricted layout configurations, which affects the precharge voltage output and image signal transmission.
Innovation Solution
A reinforcing wiring line is disposed parallel to the driving IC's wiring line on the substrate, reducing resistance and voltage fluctuations, and allowing for independent layout optimization without affecting other wiring lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If wiring lines are extended to connect the flexible substrate to the glass substrate, then the connection between substrates is achieved, but the resistance of wiring lines increases
Solution Approach 1:
The patent divides the wiring line into two separate segments: one wiring line on the flexible substrate and another wiring line on the glass substrate. These two segments are positioned to overlap each other when viewed from the front surface of the glass substrate, creating parallel conduction paths that reduce overall resistance without requiring a single long wiring line.
2Reliability
If reinforcing wiring lines are added to reduce resistance, then wiring line resistance decreases, but the layout of wiring lines becomes restricted
Solution Approach 1:
The patent utilizes the third dimension (depth/layering) by positioning wiring lines on different substrates (flexible substrate and glass substrate) that overlap when viewed from the front surface. This spatial arrangement in multiple dimensions allows reinforcing wiring lines to be added without complicating the two-dimensional layout on a single substrate plane.
3Ease of operation
If wiring lines are made longer to connect components, then connectivity is achieved, but voltage changes increase
Solution Approach 1:
The patent segments the long wiring path into two shorter wiring lines on different substrates that overlap in space. This segmentation creates parallel conduction paths that reduce the effective resistance and minimize voltage changes, while still achieving the required connectivity between components on different substrates.
Data Source
AI summary
An electro-optical device includes: a wiring substrate connected to an electro-optical panel; and a driving IC mounted on the wiring substrate. The driving IC includes a first wiring line extending in one direction, and the wiring substrate includes a first reinforcing line connected to both ends of the first wiring line at a position overlapping the driving IC and electrically connected in parallel with the first wiring line. For example, the first wiring line extends from an input terminal to other terminals, and the wiring substrate includes a wiring line that supplies power to the input terminal via an electrode to which the input terminal is connected and a first reinforcing line connected to the electrodes to which the other respective terminals are connected.