Electro-Osmotic PCB Cooling with Gas Accumulator Cavitation Control

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Solution Overview

Problem

Current cooling systems for electronic devices are inadequate in efficiently dissipating heat generated by high-density components, necessitating the development of more effective cooling methods.

Innovation Solution

A cooling system comprising an electro-osmotic pump, a gas accumulator, and a heat exchanger, all thermally coupled with a core, which uses thermal fittings for leak-proof seals and DC-powered membrane components to facilitate efficient heat transfer and fluid flow, with the core being configured to couple with a printed circuit board.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cooling systems are used for high-density electronic components, then heat dissipation capacity is limited, but system complexity and size increase when attempting to improve cooling efficiency

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidsystem complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The patent replaces conventional mechanical pumps with an electro-osmotic pump that uses electrical fields to drive coolant flow through porous membranes. This substitution reduces mechanical complexity while maintaining effective heat dissipation from high-density electronic components

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent utilizes fluid dynamics and pressure differentials created by the electro-osmotic pump to circulate coolant through the cooling channels. The system leverages hydraulic principles to achieve efficient heat transfer without complex mechanical pumping mechanisms

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Device complexity

If electro-osmotic pump is used to reduce mechanical complexity, then cavitation and electrode erosion occur, but reliability decreases

Engineering Contradiction:

Improvemechanical complexityVSAvoidpump reliability

Core Design Contradiction:

Device complexityVSReliability

Solution Approach 1:

The patent captures gas bubbles generated by cavitation during electro-osmotic pumping and redirects them back into the coolant stream. This converts the harmful cavitation effect into a beneficial gas injection mechanism, preventing electrode erosion while maintaining pump reliability and reducing mechanical complexity

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Reliability

If thermal fittings are used to create leak-proof seals, then assembly complexity increases, but sealing reliability improves

Engineering Contradiction:

Improveseal reliabilityVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent employs thermal fittings that utilize differential thermal expansion coefficients between dissimilar metals to create interference fits and leak-proof seals. The assembly process involves heating components to expand them, inserting them together, and allowing natural cooling to create tight seals, reducing the need for additional sealing components

Inventive Principle:

Principle #37Thermal expansion

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively mitigates cavitation and electrode erosion, enhances heat dissipation through radiative fins, and maintains a leak-proof seal, ensuring efficient cooling of electronic components.

Implementation Method 1

the pump includes an electro-osmotic (EO) pump... the EO pump comprises a membrane configured to be acted upon by a DC current

Methodology Applied

Scientific EffectElectro-osmosis: Electro-Osmosis

Implementation Method 2

a heat exchanger operationally coupled to the pump... the heat exchanger has a plurality of fins, the fins configured to radiate heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 3

the fins configured to radiate heat

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Implementation Method 4

the gas accumulator is operationally coupled to the pump with a thermal fitting... the heat exchanger is operationally coupled to the pump with a thermal fitting... the core is coupled to the gas accumulator with a thermal fitting

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12200908B2Cooling system and methods

Publication Date: 2025.01.14 EVANSWERKS INC

AI summary

Disclosed are systems and methods for facilitating the cooling of electronic devices. In one embodiment, a cooling system includes a pump coupled to a gas accumulator. The pump can be operationally coupled to a heat exchanger in a fluid circuit. The gas accumulator can be coupled to a core. In some embodiments, the pump is an electro-osmotic pump, and the core is a metal core printed circuit board. In certain embodiments, the gas accumulator is coupled to the pump with a thermal fitting. In one embodiment, the pump, gas accumulator, and heat exchanger are mounted on a surface of the core.