Electroactive Carrier Flattening for Semiconductor Panel Warpage
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Solution Overview
Problem
Panel warpage in semiconductor device packaging poses challenges during encapsulation and redistribution, affecting yield, reliability, and handling costs due to differing thermal expansion coefficients of materials involved.
Innovation Solution
A reusable warpage control carrier with electroactive elements is used, attached to the panel via a thermal releasable adhesive, and controlled with applied voltages to flatten the panel, allowing for precise warpage management and subsequent planar-sensitive processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If panel-level packaging is used to reduce costs and improve efficiency, then productivity and cost-effectiveness are improved, but panel warpage occurs during encapsulation and redistribution processes
Solution Approach 1:
The patent applies preliminary action by attaching a carrier substrate to the panel before encapsulation to prevent warpage from occurring in the first place. The carrier substrate is bonded to the panel's backside and provides mechanical support during the encapsulation process, maintaining panel flatness proactively rather than correcting warpage after it occurs.
Solution Approach 2:
The carrier substrate acts as an intermediary between the panel and the encapsulation process. It mediates the mechanical stresses during encapsulation and redistribution by providing a stable, flat support structure that prevents the panel from warping while allowing the encapsulation to proceed normally.
2Ease of manufacture
If panel warpage is allowed to occur naturally during encapsulation, then the encapsulation process is simpler and faster, but subsequent connection formation becomes difficult affecting yield and reliability
Solution Approach 1:
The carrier substrate is attached beforehand to prevent warpage during encapsulation, ensuring the panel remains flat for subsequent connection formation processes. This preliminary support structure eliminates the need for complex warpage correction steps while maintaining high connection quality and yield.
3Manufacturing precision
If warpage control measures are implemented during encapsulation, then panel flatness is maintained improving subsequent processing, but the process complexity and time increase
Solution Approach 1:
By attaching the carrier substrate before encapsulation, the patent simplifies the overall process compared to post-encapsulation warpage correction methods. The preliminary attachment prevents warpage proactively, eliminating the need for complex measurement and correction systems that would increase process complexity and time.
Solution Approach 2:
The carrier substrate serves as a simple intermediary component that maintains panel flatness without requiring complex control systems. It provides passive mechanical support throughout the encapsulation and redistribution processes, reducing process complexity compared to active warpage correction methods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively flattens the panel, enabling improved yield, reliability, and cost-effectiveness by facilitating precise control over warpage, thereby enhancing panel handling and processing.
Implementation Method 1
A reusable warpage control carrier is provided including a plurality of electroactive elements configured to substantially flatten a semiconductor device packaging panel
Implementation Method 2
The warpage control carrier is joined with the panel by way of a thermal releasable adhesive
Data Source
AI summary
A method of manufacturing a semiconductor device packaging panel is provided. The method includes forming a panel having an active side and a backside. The panel includes a plurality of semiconductor die encapsulated with an encapsulant. An active surface of the semiconductor die is exposed on the active side of the panel. A warpage control carrier is attached onto the backside of the panel. The warpage control carrier includes an electroactive element configured for substantially flattening the panel while a control voltage is applied to the electroactive element.