Electroactive Polymer Micro Device Assembly via Vacuum Placement
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Solution Overview
Problem
The complexity of manufacturing and packaging processes for micro devices increases with miniaturization, leading to difficulties in batch production, particularly in terms of process differences and yield, necessitating more efficient assembling and packaging methods.
Innovation Solution
A device assembling system featuring a substrate with actuated devices arranged in an array, each comprising electrodes, an electroactive material layer, and a connecting pad, along with an airtight structure and dividing plate forming a chamber with through holes, allowing for selective actuation and vacuum-assisted device placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro devices are produced using conventional manufacturing processes, then the production can be maintained with standard methods, but the manufacturing cost increases and yield decreases due to process complexity and incapability
Solution Approach 1:
The patent divides the substrate into multiple regions separated by dividing plates, allowing different manufacturing processes to be applied to different groups of micro devices simultaneously. This segmentation enables batch production of devices with different process requirements without increasing overall system complexity
Solution Approach 2:
The patent introduces a vertical dimension by stacking multiple substrates and dividing plates in layers, creating a three-dimensional assembly structure. This allows multiple manufacturing processes to occur in parallel across different layers, improving batch production efficiency while managing process complexity
2Ease of manufacture
If different manufacturing processes are applied to different micro devices in batch production, then the cost per device decreases, but the assembling and packaging methods become more complex
Solution Approach 1:
The patent combines multiple micro devices that have undergone different manufacturing processes onto a single substrate with multiple dividing plates. This merging approach allows cost-effective batch production through differentiated processing while maintaining a unified assembly structure that simplifies packaging and handling
Solution Approach 2:
The substrate and dividing plate structure serves multiple functions: it acts as both a manufacturing platform for different process groups and a unified packaging structure. This multi-functionality reduces the need for separate assembly and packaging methods for differently processed devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system enables cost-effective batch production by allowing for the selective actuation and placement of micro devices, improving yield and reducing manufacturing costs through efficient assembly and packaging.
Implementation Method 1
an electroactive material layer (203)
Implementation Method 2
vacuum-assisted device placement
Data Source
AI summary
An apparatus for assembling devices, comprising a plurality of actuated devices disposed on a substrate, each of the actuated devices comprising a first electrode disposed on and electrically connect to the substrate, a connecting pad disposed on the substrate, an electro-active polymer layer comprising a first surface disposed on the connecting pad and a second surface, and a second electrode disposed on the second surface of the electro-active polymer layer and electrically connected to the substrate.