Electroactive Ring Frame for Micro LED Transfer Precision

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Solution Overview

Problem

There are technical barriers to efficiently transferring micro light emitting diodes (micro LEDs) from a base substrate to a target substrate, requiring innovative solutions for precise and effective transfer methods.

Innovation Solution

A transfer substrate with electroactive actuators featuring a ring-shaped frame structure made of electroactive material, which undergoes reversible deformation between two states upon an electric field change, allowing for secure transfer and alignment of micro LEDs between substrates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional transfer methods are used, then the transfer process is simple, but the transfer precision and efficiency are insufficient

Engineering Contradiction:
Improvetransfer precisionVSAvoidtransfer device complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent employs a ring-shaped frame structure made of electroactive material that can dynamically change its inner diameter between a first state (larger diameter for releasing micro LEDs) and a second state (smaller diameter for securing micro LEDs). This dynamic transformation enables the same structure to perform multiple functions: securing, transferring, and releasing micro LEDs, thereby improving transfer precision without proportionally increasing device complexity

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The electroactive material in the ring-shaped frame structure changes its physical parameters (inner diameter) in response to electric field changes. By applying voltage, the frame transitions between expanded and contracted states, allowing precise control over the securing and releasing of micro LEDs. This parameter change mechanism achieves high transfer precision through controlled dimensional transformation

Inventive Principle:
Principle #35Parameter changes

2Reliability

If the ring-shaped frame structure is used to secure micro LEDs, then the transfer reliability is improved, but the device complexity increases

Engineering Contradiction:
Improvetransfer reliabilityVSAvoidtransfer device complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The ring-shaped frame structure serves multiple functions: it acts as both a securing mechanism (when contracted in the second state) and a releasing mechanism (when expanded in the first state). This multi-functionality improves transfer reliability by ensuring secure holding during transfer while enabling easy release at the destination, without requiring separate securing and releasing components that would increase device complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The electroactive material in the ring-shaped frame structure autonomously transforms between states in response to electric field changes, enabling self-securing and self-releasing of micro LEDs. This self-service capability improves transfer reliability through automatic control, reducing the need for complex external actuation mechanisms

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables accurate and efficient transfer of micro LEDs by expanding or shrinking the ring-shaped frame structure to match the size of the LEDs, ensuring secure attachment and release, thereby facilitating their movement between substrates without damage.

Implementation Method 1

the ring-shaped frame structure made of an electroactive material; and the ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure

Methodology Applied
Scientific EffectElectroactive material deformation: Electroactive Polymer

Data Source

PatentUS11289537B2Transfer substrate, method of fabricating micro light emitting diode display substrate, and micro light emitting diode display substrate
Publication Date: 2022.03.29 BEIJING BOE OPTOELECTRONCIS TECH CO LTD
  • US11289537B2 patent drawing
  • US11289537B2 patent drawing
  • US11289537B2 patent drawing

AI summary

A transfer substrate for transferring an array of a plurality of micro light emitting diodes (micro LEDs) onto a target substrate. The transfer substrate includes a base substrate and an array of a plurality of electroactive actuators. A respective one of the plurality of electroactive actuators includes a ring-shaped frame structure substantially surrounding a central opening, the ring-shaped frame structure made of an electroactive material. The ring-shaped frame structure is configured to undergo a reversible deformation between a first state and a second state upon a change in an electric field applied on the ring-shaped frame structure. A distance between two positions on an inner wall of the ring-shaped frame structure and across the central opening having a first value in the first state and a second value in the second state. The first value is greater than the second value.