Electroadhesion Holder for Fast, Non-Damaging Device Mounting
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Solution Overview
Problem
Existing mechanical mounting mechanisms for electronics devices are unreliable, bulky, and can damage devices during attachment. They also require significant time and effort to assemble and attach, and can damage foreign objects they are attached to.
Innovation Solution
The use of an electroadhesion device that employs a compliant film with electrodes and an insulating material, along with a chemical adhesive and sensors, to securely attach electronics devices to various surfaces using adjustable voltage to create an electroadhesive force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical mounting mechanisms are used to secure electronics devices, then devices can be mounted to foreign objects, but the mechanisms are unreliable and bulky
Solution Approach 1:
The patent replaces mechanical mounting mechanisms (screws, clamps, clips) with an electroadhesion system that uses electrostatic forces to attach devices to surfaces. The electroadhesion device includes electrodes that generate electrostatic attraction forces, eliminating the need for complex mechanical structures while providing reliable and adjustable mounting.
Solution Approach 2:
The patent employs sensors to detect surface characteristics and dynamically adjusts the voltage applied to electrodes, changing the electrostatic force parameters to optimize attachment reliability for different surfaces. This adaptive parameter adjustment ensures reliable mounting while keeping the device structure simple.
2Reliability
If mechanical mounting mechanisms are used, then devices can be attached securely, but they require significant time and effort to assemble
Solution Approach 1:
The electroadhesion system replaces time-consuming mechanical assembly (screwing, clamping) with simple electrical activation. The device attaches by applying voltage to electrodes, a process that takes seconds compared to manual mechanical assembly, while maintaining secure attachment through adjustable electrostatic forces.
3Reliability
If mechanical mounting mechanisms are used, then devices can be mounted, but the components can forcefully contact and damage the electronics device
Solution Approach 1:
The patent replaces mechanical contact-based mounting with non-contact electrostatic attraction. The electrodes generate electrostatic forces that hold the device without physical contact, eliminating scratches, dents, and other damage caused by screws, clamps, and clips.
Solution Approach 2:
The electroadhesion device introduces an electrostatic field as an intermediary between the mounting system and the electronics device. This field-based interaction replaces direct mechanical contact, providing secure mounting without harmful physical forces that could damage fragile components.
4Reliability
If mechanical mounting systems are used, then devices can be secured, but the mounting system may damage the foreign object during attachment
Solution Approach 1:
The electroadhesion system replaces mechanical fastening that can strip screws, crack surfaces, or damage the foreign object with electrostatic attraction. The electrostatic forces act without mechanical contact, securing the device to the foreign object without causing damage to either the device or the mounting surface.
5Reliability
If mechanical mounting systems are permanently attached to foreign objects, then mounting security is provided, but the systems are bulky and ugly when not in use
Solution Approach 1:
The patent replaces bulky mechanical mounting structures with a thin-film electroadhesion device that can be integrated into the electronics device itself or attached as a slim layer. The electrostatic generation capability is embedded in a compact form factor, eliminating the need for large mechanical components while maintaining secure mounting when activated.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The electroadhesion device allows for quick and secure attachment of electronics devices to a variety of surfaces, enabling hands-free use and preventing devices from falling or being damaged, while also being safe to use on different materials.
Implementation Method 1
a controller of the electroadhesion device holder may modify a voltage output of the electroadhesion device based on a characteristic of the target surface
Implementation Method 2
a sensor of the electroadhesion device holder may determine a characteristic of a target surface
Data Source
AI summary
Disclosed embodiments include an electroadhesion device holder for securing devices to foreign objects and other target surfaces. In various embodiments, the electroadhesion device holder may be incorporated into a device case that removably attaches to a device. The device case may include an integrated power supply for providing power to an electroadhesion device. In various embodiments electroadhesion device holder may be attached directly to a device such as a smartphone or camera. By providing a powered, portable mechanism for securing devices to foreign objects, the electroadhesion device holder may provide a better perspective for viewing a device screen and increase the field of view of a camera.