Electroadhesive Sonic Device Couplant for Ultrasonic Testing

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Solution Overview

Problem

The application and removal of traditional liquid or viscous couplants for sonic devices like ultrasonic transducers and receivers are cumbersome and can contaminate test objects, while solid couplants offer inferior wave propagation due to air interference and adhesion issues, making it difficult to move the devices without detaching them from the test object.

Innovation Solution

A sonic device with an electroadhesive element expressing body, comprising a resin crosslinked body and dispersed particles, which can change adhesion properties with voltage application, allowing for efficient sonic wave propagation while enabling easy movement by switching between adhesive and sliding modes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If liquid or viscous couplant is applied between the sonic device and test object, then efficient sonic wave propagation is achieved, but the application and removal process becomes troublesome and time-consuming

Engineering Contradiction:
Improvesonic wave propagation efficiencyVSAvoidtime for applying and removing couplant
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The invention uses a solid couplant that transitions from a rigid state during attachment to a flexible state during movement. The solid couplant maintains firm contact for efficient sonic wave propagation during testing, then allows easy detachment and repositioning by transitioning to a flexible state, eliminating the time-consuming processes of applying and removing liquid couplants.

Inventive Principle:
Principle #36Phase transitions

Solution Approach 2:

The solid couplant changes its physical parameters (rigidity to flexibility) based on operational needs. It exhibits rigid properties when attached to ensure good acoustic contact and efficient wave propagation, then transitions to flexible properties that enable easy detachment and repositioning, thereby reducing the time loss associated with couplant application and removal.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If liquid couplant is used for efficient wave transmission, then test accuracy is enhanced, but the test object may be contaminated with the couplant

Engineering Contradiction:
Improvetest accuracyVSAvoidcontamination of test object
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The invention employs a solid couplant that maintains a stable solid phase, eliminating the contamination issues associated with liquid couplants. The solid couplant provides sufficient acoustic coupling for accurate testing while its solid state prevents it from spreading or contaminating the test object surface, allowing clean attachment and detachment without residual contamination.

Inventive Principle:
Principle #36Phase transitions

3Reliability

If solid couplant with pressure sensitive adhesion is used to prevent air interference, then sonic wave propagation improves, but the sonic device cannot slide on the test object surface

Engineering Contradiction:
Improvesonic wave propagationVSAvoidmobility of sonic device
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The solid couplant dynamically changes its mechanical properties based on operational requirements. It exhibits pressure-sensitive adhesion and rigid contact when attached to ensure excellent sonic wave propagation, then transitions to a flexible, low-friction state that enables easy sliding and repositioning of the sonic device on the test object surface without requiring complete detachment.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The couplant changes its physical parameters from rigid and adhesive during attachment to flexible and low-friction during movement. This parameter change allows the device to maintain firm contact for accurate testing while enabling easy mobility when repositioning is needed, resolving the contradiction between propagation efficiency and operational ease.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If solid couplant is used to eliminate air interference, then wave propagation improves, but detachment and reattachment processes become troublesome

Engineering Contradiction:
Improvesonic wave propagationVSAvoidcomplexity of attachment and detachment processes
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The solid couplant dynamically adjusts its adhesion properties, providing strong pressure-sensitive bonding during attachment for reliable sonic wave propagation, then transitioning to a state that facilitates easy detachment and reattachment. This dynamic behavior simplifies the attachment and detachment processes while maintaining excellent wave propagation during testing.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The electroadhesive element ensures efficient ultrasonic wave propagation with minimal air interference and easy device movement, maintaining contact with the test object without contamination, enhancing testing accuracy and efficiency.

Implementation Method 1

electroadhesive element expressing body, comprising a resin crosslinked body and particles dispersed in the resin crosslinked body

Methodology Applied
Scientific EffectElectroadhesive effect: Electrostatic Induction

Implementation Method 2

sonic transducer unit configured to perform at least one of transmitting and receiving a sonic wave

Methodology Applied
Scientific EffectUltrasonic wave propagation: Ultrasound

Data Source

PatentUS11207712B2Sonic device
Publication Date: 2021.12.28 KK TOSHIBA
  • US11207712B2 patent drawing
  • US11207712B2 patent drawing
  • US11207712B2 patent drawing

AI summary

A sonic device in an embodiment includes a sonic transducer unit and a sonic propagation unit. The sonic transducer unit performs at least one of transmitting and receiving a sonic wave, and has a sonic function surface to configure at least one of a wave transmitting surface and a wave receiving surface. The sonic propagation unit includes: a substrate having a pair of electrodes; an electroadhesive element expressing body including a resin crosslinked body arranged on the substrate, and particles dispersed in the resin crosslinked body; and a power supply to apply voltage to the pair of electrodes. The sonic propagation unit is provided on the sonic function surface of the sonic transducer unit, and the electroadhesive element expressing body in the sonic propagation unit comes into contact with a test object.