Electrocaloric Material Cooling for Integrated Circuit Heat Dissipation
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Solution Overview
Problem
Existing electronic devices face performance limitations due to inadequate heat dissipation, with traditional cooling systems being cumbersome and inefficient.
Innovation Solution
The use of electrocaloric materials, specifically solid solutions of BNT, BKT, BZT, BMgT, and BNiT, which undergo a phase transition under an electric field to efficiently manage temperature in electronic devices, allowing for rapid cooling by thermally coupling these materials with integrated circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional cooling systems (air flow, liquid cooling, heat dissipation fins) are used to cool electronic devices, then heat dissipation effectiveness is improved, but device complexity and system bulkiness increase
Solution Approach 1:
The patent replaces traditional mechanical cooling systems (air flow fans, liquid cooling pumps, heat dissipation fins) with an electrocaloric cooling system that uses electric field-induced phase transitions in electrocaloric materials to achieve cooling without mechanical moving parts, thereby reducing system complexity while maintaining heat dissipation effectiveness
Solution Approach 2:
The patent utilizes the electrocaloric effect where electrocaloric materials undergo phase transitions when subjected to electric fields, causing temperature changes that can be used for cooling electronic devices. This phase transition mechanism enables efficient heat dissipation without requiring complex mechanical cooling infrastructure
2Productivity
If larger cooling systems are used to remove heat more quickly, then cooling efficiency is improved, but device size and system bulkiness increase
Solution Approach 1:
The electrocaloric cooling system replaces bulk mechanical cooling components with thin-film electrocaloric materials that can be directly integrated onto or near the electronic device, achieving rapid cooling without increasing system volume
Solution Approach 2:
The patent employs thin-film electrocaloric materials that can be deposited directly on electronic components, providing a compact, flexible cooling solution that does not increase device volume while maintaining high cooling rates through direct thermal coupling
3Temperature
If conventional cooling methods are implemented, then heat removal capability is improved, but power consumption increases
Solution Approach 1:
The electrocaloric effect utilizes reversible phase transitions in materials when subjected to electric fields, producing temperature changes that can pump heat without continuous high-power consumption. The system only requires power during phase transition cycles rather than continuous operation, significantly reducing overall power consumption compared to conventional cooling
Solution Approach 2:
The electrocaloric cooling system operates through periodic application of electric fields to induce phase transitions, creating cyclic cooling action. This periodic operation is more energy-efficient than continuous operation of traditional cooling systems, as power is consumed only during the phase transition events rather than continuously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables effective and efficient cooling of electronic devices by leveraging the electrocaloric effect, minimizing power requirements and integrating seamlessly with existing cooling systems, thus enhancing device performance.
Implementation Method 1
electrocaloric materials, specifically solid solutions of BNT, BKT, BZT, BMgT, and BNiT, which undergo a phase transition under an electric field to efficiently manage temperature in electronic devices
Implementation Method 2
allowing for rapid cooling by thermally coupling these materials with integrated circuits
Data Source
AI summary
The present disclosure is drawn to electrocaloric devices, methods of making electrocaloric integrated circuits, and methods of thermally cycling integrated circuits. The electrocaloric device can include an electrocaloric material having a solid solution of two or more components of BNT, BKT, BZT, BMgT, or BNiT. The electrocaloric material can have an ergodic transition temperature within a range of 50 C to 300 C. The device can also include electrodes associated with the electrocaloric material, as well as an electrical source to add or reduce electrical field between the electrodes across the electrocaloric material to generate heating or cooling relative to the ergodic transition temperature of the electrocaloric material.