Electrochemically Debondable Adhesive for Substrate Separation
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Solution Overview
Problem
Existing debondable adhesives are limited in their ability to disassemble bonded structures, particularly those with non-electrically conductive substrates, as they require aggressive chemicals or high temperatures, which can damage the substrates.
Innovation Solution
A bonded structure comprising a first and second substrate with electrically conductive surfaces, where at least one surface is provided by a dried ink film with a polymeric resin and electrically conductive particles, and an electrochemically debondable adhesive obtained by applying a curable composition with a non-polymerizable electrolyte and a polymeric resin.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of repair
If mechanical processes (sand blasting or wire brushing) are used to remove adhesive, then adhesive removal is achieved, but substrate surfaces are corrupted and the adhesive is inaccessible or difficult to abrade
Solution Approach 1:
The patent replaces mechanical removal processes (sand blasting, wire brushing) with an electrochemical debonding system. The adhesive contains electrochemically active components that react when electrical current is applied, causing the adhesive to decompose and detach from substrates without mechanical contact, thereby avoiding substrate corruption while enabling complete adhesive removal.
Solution Approach 2:
The patent changes the chemical state of the adhesive through electrochemical reactions. By applying electrical current, the adhesive undergoes oxidation-reduction reactions that alter its molecular structure, transforming it from a bonded state to a debonded state. This parameter change enables adhesive removal without mechanical force, solving both the accessibility problem and substrate protection requirement.
2Ease of repair
If chemicals or high temperature are applied to disassemble bonded structures, then adhesive debonding is achieved, but substrates are damaged and become unsuitable for subsequent applications
Solution Approach 1:
The patent replaces chemical and thermal debonding methods with an electrochemical system. Electrical current triggers specific electrochemical reactions within the adhesive that cause controlled decomposition and debonding. This substitution eliminates the need for aggressive chemicals and high temperatures that damage substrates, while achieving complete adhesive removal through selective electrochemical activation.
Solution Approach 2:
The adhesive itself acts as an intermediary containing electrochemically active components. These components mediate the debonding process by undergoing electrochemical reactions when electrical current is applied, transforming the adhesive's bonding properties without requiring external chemicals or extreme temperatures that would harm the substrates.
3Ease of operation
If electrochemically debondable adhesive is used, then easy disassembly by applying voltage is achieved, but the adhesive composition becomes more complex requiring electrolytes and conductive components
Solution Approach 1:
The patent merges multiple functions into the adhesive composition: bonding function, electrochemical activity, and ionic conductivity. By incorporating electrolytes and electrochemically active components directly into the adhesive matrix, the system achieves easy voltage-driven disassembly while integrating the complexity within the adhesive itself rather than requiring separate systems for bonding and debonding.
Solution Approach 2:
The adhesive composition serves multiple functions: it provides strong bonding when cured, enables electrochemical debonding when voltage is applied, and maintains ionic conductivity for electrochemical reactions. This multi-functionality achieves ease of operation for disassembly while consolidating the complexity within a single universal adhesive system that handles both bonding and debonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables efficient disbonding of substrates by applying a voltage, which weakens the adhesive bond without damaging the substrates, thus facilitating easy separation and potential recycling of the bonded structure.
Implementation Method 1
the passage of an electrical current through the adhesive acts to disrupt the bonding at the interface of the adhesive and the substrate
Implementation Method 2
the electrolyte provides sufficient ionic conductivity to said composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 3
the electrolyte provides sufficient ionic conductivity to said composition to support a faradaic reaction
Implementation Method 4
a dried ink film comprising a polymeric resin and electrically conductive particles
Data Source
Figure 1a~3b
AI summary
The present disclosure is directed to a bonded structure comprising: a first substrate provided with a first electrically conductive surface; a second substrate provided with a second electrically conductive surface; and, an adhesive interposed between said first and second electrically conductive surfaces, wherein at least one of said first and second electrically conductive surfaces is provided by a dried ink film comprising: a matrix of a polymeric resin (FR); and, electrically conductive particles, further wherein said adhesive is electrochemically debondable and is obtained by applying a curable liquid-state composition to at least one of said first and second electrically conductive surfaces followed by the curing of said composition, wherein the curable composition comprises a non-polymerizable electrolyte and a polymeric resin (AR).