Electrochemically Debondable PSA for Substrate Removal
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Solution Overview
Problem
Existing adhesive compositions are difficult to debond from substrates without damaging them, as mechanical removal methods are inefficient and chemical or high-temperature methods are time-consuming and risk damaging the substrates.
Innovation Solution
A solvent-borne electrochemically debondable pressure-sensitive adhesive composition comprising 5-80 wt% (meth)acrylate copolymer, 0.1-30 wt% non-polymerizable electrolyte, and 10-90 wt% solvent, which can be debonded by applying a voltage across conductive surfaces, disrupting the adhesive bond through faradaic reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If mechanical removal methods (sand blasting, wire brushing) are used to remove adhesive, then adhesive can be removed from substrates, but substrate surfaces are corrupted and the process is inefficient
Solution Approach 1:
The patent replaces mechanical removal methods with electrochemical debonding. An electrolyte composition is applied to the adhesive bond, and an electrical current is passed through it to generate gases via electrolysis that disrupt the adhesive-substrate interface, enabling removal without mechanical contact with the substrate surface.
Solution Approach 2:
The patent introduces an electrolyte composition as an intermediary substance between the adhesive and the substrate. This electrolyte facilitates the debonding process through electrochemical reactions, acting as a mediator that enables adhesive removal while protecting the substrate from direct mechanical or chemical damage.
2Ease of operation
If chemical or high-temperature debonding methods are used, then adhesive bonds can be disrupted, but the process is time-consuming and substrates may be damaged
Solution Approach 1:
The patent replaces thermal and chemical debonding methods with an electrochemical process. By applying electrical current through the electrolyte-composed adhesive, debonding occurs through electrochemical reactions rather than prolonged chemical exposure or high-temperature treatment, significantly reducing the time required.
Solution Approach 2:
The patent changes the fundamental parameter of debonding from thermal/chemical to electrochemical. This parameter change enables faster debonding times while avoiding the substrate damage associated with aggressive chemicals and high temperatures, as the electrochemical process can be precisely controlled.
3Ease of operation
If chemical or high-temperature debonding methods are used, then adhesive bonds can be disrupted, but substrate surfaces are damaged rendering them unsuitable for subsequent applications
Solution Approach 1:
The patent replaces destructive chemical and thermal methods with electrochemical debonding. The electrolyte-based electrochemical process disrupts adhesive bonds through gas generation and electrochemical reactions without exposing substrates to damaging chemicals or high temperatures, preserving substrate integrity for subsequent applications.
Solution Approach 2:
The electrolyte composition serves as a protective intermediary that enables adhesive removal while preventing direct contact between substrates and harmful agents. This intermediary approach ensures substrates remain undamaged and suitable for reuse, maintaining their reliability for subsequent applications.
4Ease of operation
If electrochemically debondable adhesive compositions are used, then adhesive can be removed by electrical current, but the composition requires specific ionic compounds with limited melting point ranges
Solution Approach 1:
The patent changes the formulation approach by using a solvent-borne composition with dissolved ionic compounds instead of relying on compounds with specific melting points. This parameter change in the formulation strategy enables electrochemical debonding functionality while providing greater flexibility in composition design and avoiding the constraints of limited melting point ranges.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective and efficient debonding of substrates with a significant reduction in bond strength by 50% within 30 minutes at 30V, without damaging the substrates, facilitating easy removal while maintaining adhesive properties.
Implementation Method 1
sufficient ion conductive properties to enable a weakening of said adhesive bond at the application of a voltage across the adhesive composition
Implementation Method 2
disrupting the bonding at the interface of the adhesive and the substrate through faradaic reactions
Data Source
AI summary
The present application is directed to a bonded structure comprising: a first substrate having an electrically conductive surface; and, a second substrate having an electrically conductive surface; wherein an electrochemically-debondable pressure sensitive adhesive film is disposed between the electrically conductive surfaces of the first and second substrates, said adhesive film being obtained by drying of a solvent-borne composition comprising, based on the weight of the composition: from 5 to 80 wt. % of a) at least one (meth)acrylate copolymer; from 0.1 to 30 wt. % of b) non-polymerizable electrolyte; and, from 10 to 90 wt. % of c) solvent.