Electrochemical Embedding of Electronic Devices in Metal Shells

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Solution Overview

Problem

Conventional additive manufacturing processes, such as powder bed fusion and ultrasonic methods, pose risks to temperature-sensitive and vibration-sensitive electronic devices due to high temperatures and vibrations, limiting their integration within metallic structures.

Innovation Solution

An electrochemical additive manufacturing method involving a build plate coupled to a power source, with deposition anodes in an electrolyte solution, deposits material to encase electronic devices, forming a shell that protects them during the manufacturing process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If powder bed fusion-based metal additive manufacturing processes are used, then metallic structures can be manufactured, but high temperatures generated can damage temperature-sensitive electronic devices

Engineering Contradiction:

Improveprocess temperatureVSAvoidthermal damage to electronic devices

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces thermal-based metal deposition (powder bed fusion) with electrochemical deposition. Instead of using high-temperature laser melting, the invention uses electrochemical reactions to deposit metal ions from an electrolyte solution onto a cathode, forming metallic structures at ambient or controlled low temperatures that do not damage electronic devices.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the fundamental process parameter from high temperature to electrochemical potential control. By controlling voltage and current density in the electrochemical deposition process, metal is deposited at temperatures suitable for embedding temperature-sensitive electronic devices, thereby resolving the thermal damage issue.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If ultrasonic additive manufacturing is used, then lower temperatures are generated, but high vibrations induced can damage vibration-sensitive electronic devices

Engineering Contradiction:

Improveprocess temperatureVSAvoidvibration damage to electronic devices

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the ultrasonic vibration-based metal deposition mechanism with an electrochemical deposition mechanism. Instead of using ultrasonic waves to facilitate material bonding, the invention uses electrochemical reactions driven by electrical current, eliminating the harmful vibrations while maintaining low-temperature operation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Strength

If conventional welding processes are used to embed electronic devices, then metallic structures can be formed, but high temperatures and vibrations can damage electronic devices

Engineering Contradiction:

Improvebond strengthVSAvoidthermal and vibration damage to electronic devices

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent replaces conventional welding (thermal/mechanical bonding) with electrochemical deposition. The metal is deposited directly onto and around the electronic device components through electrochemical reactions, creating strong metallurgical bonds without the need for high-temperature welding processes that generate harmful thermal and vibration effects.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively integrates electronic devices within metallic structures without damaging them, offering a safer and more precise manufacturing process.

Implementation Method 1

transmitting electrical energy from the power source, through the one or more deposition anodes of the plurality of deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion

Methodology Applied

Scientific EffectElectrochemical deposition: Electrodeposition

Data Source

PatentUS12595579B2Embedding electronic devices using electrochemical additive manufacturing

Publication Date: 2026.04.07 FABRIC8LABS INC

AI summary

An electrochemical additive manufacturing method includes coupling a first electronic device to a build plate and positioning the build plate into an electrolyte solution. The method also includes positioning a deposition anode array into the electrolyte solution, connecting the cathode portion of the build plate and one or more deposition anodes of the abide array to a power source. The method also includes transmitting electrical energy from the power source, through the one or more deposition anodes, through the electrolyte solution, and to the cathode portion of the build plate, such that material is deposited onto the cathode portion and forms at least a sidewall of a shell that encases the first electronic device against the build plate when the first electronic device is coupled to the build plate. The shell and the first electronic device form a second electronic device.