Electrochemically Disbondable 1K Adhesive Composition
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Solution Overview
Problem
Existing adhesive compositions are difficult to disassemble and re-use, as the cross-linked chemical network formed during curing cannot be easily re-activated for bonding substrates again, which is a challenge in industries that require recycling or re-purposing of materials.
Innovation Solution
A one-component (1K) curable and electrochemically disbondable adhesive composition comprising at least one epoxide compound, a curing agent without disulfide functional groups, a healing agent with disulfide functional groups, and an electrolyte, which allows for the recovery of bonding ability after electrochemical disbonding through thermal activation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a cross-linked chemical network is formed during adhesive curing to bond substrates together, then bond strength and stability are improved, but the adhesive cannot be easily disassembled or re-used
Solution Approach 1:
The patent changes the chemical parameters of the adhesive by incorporating disulfide bonds and electrolytes. The disulfide bonds can be reduced to break the cross-linked network, and the electrolyte enables electrochemical reactions that facilitate disbonding. This allows the adhesive to maintain strong bonds during use while enabling controlled disassembly through electrochemical means.
Solution Approach 2:
The patent extracts the disulfide functional groups from the curing agent or introduces them as separate healing agents. These disulfide groups can be selectively reduced to break the cross-linked network and enable disbonding, while the rest of the adhesive matrix remains intact and can be re-used.
2Ease of operation
If mechanical processes such as sand blasting or wire brushing are used to remove adhesive, then adhesive removal is achieved, but substrate surfaces are damaged and adhesive cannot be re-used
Solution Approach 1:
The patent replaces mechanical removal processes with electrochemical disbonding. By applying an electrical potential, electrochemical reactions occur at the substrate-adhesive interface that facilitate adhesive removal without mechanical contact, thereby preventing substrate damage while achieving adhesive removal.
3Ease of operation
If aggressive chemicals or high temperature are applied to remove adhesive, then adhesive disbonding is achieved, but substrate surfaces are damaged and the process is time consuming
Solution Approach 1:
The patent replaces chemical and thermal methods with electrochemical disbonding. The electrochemical process uses mild electrical potentials to drive reactions that break the adhesive-substrate bond, avoiding the need for aggressive chemicals or high temperatures that could damage substrates or extend processing time.
4Reliability
If the adhesive is designed to be strong for maintaining adhesion during drop or impact events, then bond reliability is improved, but adhesive removal and component recycling become difficult
Solution Approach 1:
The patent introduces disulfide bonds and electrolytes as key parameters in the adhesive formulation. The disulfide bonds provide strong adhesion during use but can be selectively reduced to enable controlled disbonding. The electrolyte facilitates the electrochemical reactions needed for disbonding, allowing the adhesive to be both strong and removable.
Solution Approach 2:
The patent extracts the disulfide functional groups as separate healing agents or incorporates them into the curing agent. These disulfide groups act as sacrificial elements that can be selectively reduced to break the cross-linked network and enable component removal, while the rest of the adhesive matrix remains intact for potential re-use.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition provides excellent bond stability under high temperature and humidity conditions, facilitates easy disbonding with electrical potential, and allows for the re-use of the cured adhesive in bonding substrates, enhancing the recyclability and re-purposing of materials.
Implementation Method 1
the electrolyte provides sufficient ionic conductivity to said composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 2
the electrolyte provides sufficient ionic conductivity to said composition to support a faradaic reaction at a bond formed between the composition and an electrically conductive surface
Implementation Method 3
which can also be electrochemically debonded from particular substrates to which it is applied and which at least partially recovers its ability to bond substrates after the electrochemical disbonding operation
Implementation Method 4
a healing agent consisting of one or more compounds which contain at least one disulfide functional group
Data Source
AI summary
The present disclosure is directed to a curable and electrochemically disbondable one component (1K) adhesive composition comprising:a) at least one epoxide compound;b) a curing agent consisting of one or more compounds which have at least one epoxide reactive group and which do not possess a disulfide functional group;c) a healing agent consisting of one or more compounds which contain at least one disulfide functional group and optionally at least one epoxide reactive group selected from: hydroxyl; thiol; amine; or, carboxyl; and,d) an electrolyte,wherein the composition is characterized by a molar ratio of epoxide-reactive groups to epoxide groups of from 0.6:1 to 1.2:1.