Electrochemical Laminate Structure for Blocking and Low-Temp Adhesion
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Solution Overview
Problem
Conventional laminates for electrochemical devices face challenges in achieving a balance between blocking resistance and low-temperature adhesiveness, particularly during storage and transportation, which affects the production efficiency and performance of electrochemical devices.
Innovation Solution
A laminate comprising a substrate with a functional layer containing heat-resistant fine particles, adhesive particles with a polyester polymer having a specific glass-transition temperature, and a binder, where the adhesive particles have a larger volume-average particle diameter than the heat-resistant region, enhancing both blocking resistance and low-temperature adhesiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional adhesives are used to bond porous substrates in electrochemical elements, then bonding strength may be achieved, but adhesive residues remain in the pores causing performance degradation and reliability issues
Solution Approach 1:
The invention extracts and eliminates the harmful adhesive residues from the porous structure by using solvents or plasma treatments to remove conventional adhesive remnants from the pores, thereby preventing performance degradation while maintaining bonding strength
Solution Approach 2:
The invention introduces intermediary substances such as solvents or plasma as mediators between the adhesive and porous substrate to facilitate complete bonding without residue formation, allowing the adhesive to bond effectively while being fully removable or decomposable
2Ease of manufacture
If non-porous substrates are used, then adhesive bonding is easier, but mass transport and reaction kinetics are limited
Solution Approach 1:
The invention applies different properties to different parts of the substrate: the surface is treated to be non-porous or less porous for easy adhesive bonding, while the bulk interior maintains porosity for efficient mass transport and reaction kinetics
3Productivity
If porous substrates are used, then mass transport is improved, but conventional adhesives leave residues in pores causing performance issues
Solution Approach 1:
The invention changes the parameters of the adhesive system by using solvents or plasma treatments to alter the state and removability of adhesive residues, enabling complete elimination of residues from porous structures while maintaining porosity for mass transport
4Strength
If porous substrates with low porosity are used, then adhesive bonding improves, but mass transport and reaction kinetics deteriorate
Solution Approach 1:
The invention creates local quality differentiation where the substrate surface has low porosity or is sealed for strong adhesive bonding, while the interior bulk maintains high porosity for efficient mass transport and fast reaction kinetics
Data Source
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AI summary
It could be helpful to provide a laminate for an electrochemical device that can advantageously be used as a device member having excellent blocking resistance and low-temperature adhesiveness. The laminate includes a substrate and a functional layer. The functional layer contains heat-resistant fine particles; adhesive particles containing an adhesive polymer; and a binder. The adhesive polymer contains a polyester polymer having a glass-transition temperature in a range of not lower than 10°C and not higher than 95°C. In plan view of the laminate from a side corresponding to the functional layer, the functional layer includes an adhesion region formed of the adhesive particles and a heat-resistant region formed of the heat-resistant fine particle and the binder. In the laminate, the volume-average particle diameter of the adhesive particles is larger than the average stacking direction height of the heat-resistant region.