3D-Printed Electrochromic Interlayers for Uniform Curved Lamination

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Solution Overview

Problem

Existing methods for producing laminated variable light transmission devices, such as electrochromic and liquid crystal devices, face challenges in achieving uniform thickness and bubble-free lamination, particularly when using substrates of varying geometries and curvatures, leading to non-uniform optical properties and increased waste and processing costs.

Innovation Solution

A method involving 3D printing of a thermoplastic polymeric composition on a substrate, followed by sandwiching with a second substrate under heat and pressure to form a laminated structure, allowing for uniform interlayer thickness and bubble-free assembly, suitable for substrates of any shape or curvature, and enabling the integration of active components like electrochromic and liquid crystalline materials.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional lamination methods are used with substrates of varying geometries and curvatures, then production capability is maintained, but uniform thickness and bubble-free lamination cannot be achieved

Engineering Contradiction:
Improveuniform thicknessVSAvoidsubstrate geometry flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent applies parameter changes by controlling the deposition parameters of the interlayer material to achieve uniform thickness across substrates of varying geometries and curvatures. The deposition process parameters (such as deposition rate, temperature, and material flow) are adjusted to accommodate different substrate shapes while maintaining consistent interlayer thickness.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent implements local quality by allowing the interlayer deposition process to adapt to local substrate characteristics. The deposition system can modify material distribution locally based on substrate curvature and geometry, ensuring uniform thickness across different regions of the substrate while maintaining overall process efficiency.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If conventional lamination methods are used, then processing is simpler, but increased waste and processing costs occur

Engineering Contradiction:
Improveprocessing simplicityVSAvoidmaterial waste
Core Design Contradiction:
Ease of manufactureVSLoss of substance

Solution Approach 1:

The patent applies preliminary action by depositing the interlayer material directly in its final position and configuration before lamination. This direct deposition method eliminates the need for subsequent trimming, cutting, or removal of excess material, thereby reducing material waste while maintaining processing simplicity.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent replaces mechanical post-processing operations (such as trimming and cutting) with a controlled deposition process that forms the interlayer to the exact required dimensions. This substitution eliminates material waste associated with mechanical removal while simplifying the overall manufacturing process.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Device complexity

If pre-formed interlayer materials are used, then inventory management is simpler, but supply chain complexities increase

Engineering Contradiction:
Improveinventory managementVSAvoidsupply chain flexibility
Core Design Contradiction:
Device complexityVSAdaptability or versatility

Solution Approach 1:

The patent extracts the interlayer material from pre-formed stock and instead deposits it directly during the lamination process. This eliminates the need for inventory management of pre-formed interlayer materials and their associated supply chain complexities, while allowing for on-demand production with exact material specifications.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent implements self-service by integrating interlayer material deposition directly into the lamination process. The system produces the interlayer material as needed during manufacturing, eliminating dependence on external supply chains and inventory management while maintaining production flexibility and adaptability.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach ensures high-quality, uniform laminates with active optical properties, reduces waste and processing costs, and allows for the production of laminated glass and other structures with complex geometries, including automotive glass, while maintaining optical clarity and reducing inventory and supply chain complexities.

Implementation Method 1

applying heat and pressure to melt and flow the thermoplastic composition and form the laminates

Methodology Applied
Scientific EffectMelting: Melting

Implementation Method 2

subjecting the assembly to vacuum (or reduced pressure) to remove any trapped air or gas bubbles

Methodology Applied
Scientific EffectVacuum: Vacuum

Data Source

PatentUS12472712B2Fabrication of variable transmission devices using printed interlayers
Publication Date: 2025.11.18 POLYCEED INC
  • US12472712B2 patent drawing
  • US12472712B2 patent drawing
  • US12472712B2 patent drawing

AI summary

Methods and materials to fabricate laminated variable transmission devices are disclosed, particularly the laminates of electrochromic devices where the electrolytic interlayer is deposited by 3d printing (or also called additive manufacturing process). Printing may be used to form both an interlayer and a sealant located at the perimeter of the interlayer. A lamination process to form the EC device combines the assembly of a protective film using a third substrate is also disclosed.