Electrochromic Device Substrate Penetration Contacting
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Solution Overview
Problem
Existing electrochromic devices face challenges in providing simple, robust, and aesthetically attractive electrical connections, often resulting in mechanical damage, trapped air pockets, and non-functioning peripheries due to the complexity of connecting electron conducting layers, especially when bus bars protrude outside the device edge seal.
Innovation Solution
The solution involves arranging connection means to penetrate the substrate opposite to the electron conducting layer, with penetration openings created at different lateral positions, allowing for robust attachment without influencing the edge seal, using methods like drilling, laser ablation, or punching, and utilizing attachment materials like ultrasonic soldering or electron conducting glues.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bus bars are allowed to protrude outside the edge seal for electrical connection, then electrical connectivity is achieved, but the sealing and contacting becomes complex and risky, increasing mechanical damage and trapped air pockets
Solution Approach 1:
The connection means penetrate through the substrate from the opposite side, transitioning from lateral connection (along the edge) to vertical connection (through the thickness dimension). This allows electrical connection without compromising the edge seal integrity, as the connection path is perpendicular to the sealing surface.
Solution Approach 2:
Instead of extending connection means from the electron conducting layer outward through the edge seal, the invention inverts the approach by penetrating through the substrate from the opposite side. This reverses the conventional connection direction and eliminates the need for complex edge sealing around protruding bus bars.
2Reliability
If substrates are cut in different shapes or displaced to enable connection, then electrical connectivity is achieved, but the device complexity increases and aesthetic appeal is reduced
Solution Approach 1:
The connection means utilize the thickness dimension by penetrating through the substrate, allowing electrical connection without requiring changes to the lateral substrate shapes. This maintains congruent substrate geometries while achieving reliable electrical connectivity through vertical penetration.
3Reliability
If connection means penetrate the substrate, then robust electrical connection is achieved without influencing the edge seal, but manufacturing precision requirements increase
Solution Approach 1:
The penetration openings are created in advance in the substrates before assembling the electrochromic stack. This preliminary action allows precise positioning of connection means without requiring high precision during the final assembly, as the openings are already in place to guide the connection leads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides mechanically robust electrical connections that do not compromise the edge seal reliability, reducing the risk of mechanical damage and optical defects, while ensuring consistent device operation and aesthetic appeal.
Implementation Method 1
utilizing attachment materials like ultrasonic soldering or electron conducting glues
Implementation Method 2
utilizing attachment materials like ultrasonic soldering or electron conducting glues
Implementation Method 3
using methods like drilling, laser ablation, or punching
Data Source
Figure 1
Figure 2A
Figure 2B
AI summary
An electrochromic device (50) comprises at least the typical five layer stack (12, 14, 16, 18, 20) between two substrates (22, 24) and connections means (42, 44, 66) to the electron conducting layers ( 12, 14). At least one of the connections means (42, 44, 66) are arranged through the substrate (22, 24). In preferred embodiments the points where the connection means (42, 44, 66) penetrate the substrates are situated at different lateral positions. The substrates (22, 24) are typically plastic substrates. In another aspect of the invention, a manufacturing method providing an electrochromic device (50) according to the above described principles is provided.