Electroconductive Film With Varying Wire Widths
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Solution Overview
Problem
Existing electroconductive films with thin metal wire mesh patterns face challenges in achieving high transparency, suppressing moire, and maintaining yield, particularly when the average line width is reduced below 7 μm, as they tend to break and suffer from inadequate light transmission and increased moire issues.
Innovation Solution
An electroconductive film with an insulating substrate and thin metal wires having varying line widths, where the difference between maximum and minimum line widths is between 20% and 75% of the average line width, and the average line width ranges from 1 μm to 7 μm, along with a manufacturing method involving a silver halide emulsion layer exposed through a glass mask with a roughened surface, ensuring high transparency and reduced moire.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If the average line width of thin metal wires is reduced to below 7 μm to achieve higher transparency, then light transmission is improved, but the wires tend to break and manufacturing yield decreases
Solution Approach 1:
The patent applies local quality by creating regions with different line widths within the mesh pattern. Specifically, it forms first thin metal wires with a first average line width and second thin metal wires with a second average line width that is larger than the first. This local variation in line width allows certain areas to provide higher transparency while other areas maintain structural strength, thereby resolving the contradiction between light transmission and wire integrity.
2Object-generated harmful factors
If the line width variation is increased to suppress moire, then moire generation is reduced, but manufacturing precision becomes more difficult to achieve
Solution Approach 1:
The patent implements local quality by deliberately creating different line width characteristics in different regions of the mesh pattern. First thin metal wires have a first average line width while second thin metal wires have a second average line width that is larger. This controlled local variation effectively suppresses moire generation while remaining manufacturable through established photolithography processes.
Solution Approach 2:
The patent applies parameter changes by varying the line width parameter across different regions of the electroconductive film. It specifies that the second average line width should be in the range of 1.5 μm to 5 μm, which is larger than the first average line width. This parameter variation is achieved through photolithography process control and effectively suppresses moire while maintaining manufacturing feasibility.
3Object-generated harmful factors
If the difference between maximum and minimum line widths is increased to suppress moire, then moire is reduced, but thin metal wires start breaking at minimum line width portions
Solution Approach 1:
The patent resolves this contradiction by applying local quality through strategic line width variation. It creates first thin metal wires with a first average line width and second thin metal wires with a second average line width that is larger. This local differentiation allows the mesh pattern to suppress moire through variation while maintaining adequate wire strength in critical areas, preventing breakage at minimum line width portions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high transparency, suppresses moire generation, and increases yield by maintaining the integrity of thin metal wires while allowing for effective light transmission and reduced resistance changes during bending tests.
Implementation Method 1
a photosensitive material is subjected to proximity exposure through a photomask that is spaced by a proximity gap in the range from 70 to 200 μm
Implementation Method 2
forming a mesh pattern of thin metal wires by proximity exposure of a photosensitive material through a photomask
Data Source
AI summary
An electroconductive film and a method for manufacturing the electroconductive film, having an insulating substrate and an electrode including a thin metal wire disposed on the surface of the insulating substrate, wherein the width of the thin metal wire varies, the difference between the maximum wire width and the minimum wire width of the thin metal wire is 20% to less than 75% of the average wire width of the thin metal wire, and the average wire width is 1-7 μm.