Electroconductive Resin Composition for Heat-Stable Adhesive Strength
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Solution Overview
Problem
Resin compositions used in electronic components face challenges in maintaining high adhesive strength and heat resistance, particularly in experiencing significant changes in adhesive strength when exposed to elevated temperatures.
Innovation Solution
A resin composition incorporating a compound with an OH group and primary to tertiary amines, dicyandiamide, and liquid bismaleimides, which also includes epoxy groups or cyanate ester, providing long-term heat resistance and a low change ratio in adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional resin compositions (polybenzoxazine-modified bismaleimide or epoxy-benzoxazine-diallylbisphenol A) are used to achieve heat resistance, then heat resistance is improved, but adhesive strength changes significantly during heating
Solution Approach 1:
The invention changes the chemical composition parameters by introducing a specific compound containing both OH group and primary/secondary/tertiary amine groups (compound A), combined with dicyandiamide (B) and bismaleimide (C) in controlled ratios. This parameter change in molecular structure and composition enables the resin to maintain stable adhesive strength across temperature ranges while achieving heat resistance, resolving the contradiction between heat resistance and adhesive stability.
Solution Approach 2:
The invention creates a composite resin system integrating multiple functional components: compound A (with OH and amine groups), dicyandiamide (B), and bismaleimide (C), optionally with epoxy compound (D) or cyanate ester. This composite material approach combines the heat resistance properties of bismaleimide with the adhesive stability provided by the multifunctional compound A, achieving both requirements simultaneously.
2Duration of action of stationary object
If resin composition is designed for long-term heat resistance, then heat resistance is improved, but adhesive strength at elevated temperatures deteriorates
Solution Approach 1:
The invention optimizes the molecular structure parameters by incorporating compound A with specific functional groups (OH and amine) that provide thermal stability. The controlled ratios of components (A: 1-10 parts, B: 0.1-5 parts, C: 5-50 parts per 100 parts epoxy resin) create a balanced composition that maintains adhesive strength at elevated temperatures while ensuring long-term heat resistance through the stable crosslinked network formed by these components.
Solution Approach 2:
Compound A acts as an intermediary molecule that bridges the requirements for heat resistance and adhesive strength. Its dual functionality (OH groups for hydrogen bonding and amine groups for crosslinking) allows it to mediate between the heat-resistant bismaleimide network and the adhesive interface, maintaining strong adhesion even at elevated temperatures over long periods.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves excellent long-term heat resistance and maintains high adhesive strength at both normal and elevated temperatures, reducing the change ratio of adhesive strength and preventing cracks in cured products.
Implementation Method 1
a resin composition including a compound A having in its molecule an OH group and any one of primary to tertiary amines, wherein A is a compound having a benzoxazine backbone, compound B being dicyandiamide, and compound C being bismaleimides
Data Source
Figure 1~2
AI summary
There is provided a resin composition having long-term heat resistance and a low change ratio of adhesive strength. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide, and (C) bismaleimides.