Electroconductive Stack Body with Controlled Nanowire Network
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Solution Overview
Problem
Existing electroconductive stack bodies with linear structural components, such as CNT, metal nanowires, or metal nanorods, face challenges in achieving low surface resistance values due to difficulties in controlling network structures and dispersion, leading to insufficient electroconductivity.
Innovation Solution
A construction with an electroconductive layer on a substrate featuring a network structure made by silver nanowires, where the average opening area of the network structure is less than 20 μm² and the variation deviation is less than 26 μm², combined with a compound having a specific molecular structure and a high-molecular matrix, applied using a hydrophilic substrate and a controlled drying process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a network structure is formed using linear electroconductive components (CNT, metal nanowires, or metal nanorods), then the electroconductive layer can be created, but the surface resistance value becomes high and sufficient electroconductivity cannot be obtained
Solution Approach 1:
The patent changes the key parameter of opening area distribution in the network structure. By controlling the average opening area to be 5 μm² or less and the standard deviation to be 10 μm² or less, the network structure achieves optimal electroconductivity. This parameter optimization allows the linear structural bodies to form a denser, more uniform network that reduces surface resistance while maintaining the benefits of using linear components.
Solution Approach 2:
The patent employs a composite approach by combining linear structural bodies (such as metal nanowires or CNTs) with a binder material to form an electroconductive layer. This composite structure allows the linear components to provide conductive pathways while the binder holds them in a controlled arrangement, achieving low surface resistance through optimized network formation rather than relying on the linear components alone.
2Ease of manufacture
If CNT is used as the electroconductive component, then the electroconductive layer can be formed, but dispersion is difficult and it is hard to control the network structure
Solution Approach 1:
The patent introduces a binder as an intermediary substance that facilitates the dispersion and arrangement of linear electroconductive components. The binder acts as a medium that holds the linear structural bodies in a controlled network structure, making it easier to manufacture consistent electroconductive layers. This intermediary approach solves the dispersion difficulty by providing a matrix that distributes the linear components uniformly.
Solution Approach 2:
The patent optimizes the parameter of opening area distribution to control the network structure formation. By setting the average opening area to 5 μm² or less and the standard deviation to 10 μm² or less, the network structure achieves optimal electroconductivity. This parameter optimization allows the linear structural bodies to form a denser, more uniform network that reduces surface resistance while maintaining the benefits of using linear components.
3Productivity
If metal nanowires are stacked on substrate without controlling the dispersed state, then the electroconductive layer can be formed, but the surface resistance value remains high and special processing steps are required
Solution Approach 1:
The patent changes the key parameter of opening area distribution in the network structure. By controlling the average opening area to be 5 μm² or less and the standard deviation to be 10 μm² or less, the network structure achieves optimal electroconductivity. This parameter optimization allows the linear structural bodies to form a denser, more uniform network that reduces surface resistance while maintaining the benefits of using linear components.
Solution Approach 2:
The patent enables the electroconductive layer to achieve low surface resistance through self-organization of linear structural bodies into a controlled network structure during the drying process. The capillary action and evaporation dynamics during drying cause the linear components to automatically arrange themselves into an optimal network pattern, eliminating the need for special post-processing steps while achieving low surface resistance.
Data Source
AI summary
An electroconductive stack body having on at least one side surface of a substrate an electroconductive layer that has a network structure that is made by a linear structural body, wherein, an opening portion that satisfies Expression (1) in an opening area of an opening portion that is formed by the network structure, average value A of the opening area is less than or equal to 20 μm2 and variation deviation &sgr;of the opening area defined by Expression (2) is less than or equal to 26 μm2: X<Xmax ×0.9 Expression (1) &sgr;={&Sgr;(X−A)2)/N}0.5 (wherein for &Sgr;, i=1 to N) Expression (2) wherein in the expressions, X represents each of the opening areas of the opening portions that satisfy Expression (1), Xmax represents the maximum value of each opening area, A represents the average value of the opening areas X, and N represents the total number of the opening portions that satisfy Expression (1).