Electroconductive Substrate Trench Imprinting and Plating
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Solution Overview
Problem
Existing electroconductive substrates used in touch panels and displays face challenges with high production costs due to expensive materials like ITO or electroconductive nanowires, and suffer from peeling and decreased electroconductivity when bent, especially when using etching methods that require multiple steps.
Innovation Solution
A method involving a trench formation on a transparent base material using an imprint method with a mold, followed by metal plating that grows from a catalyst-containing foundation layer, forming a pattern layer that fills the trench and maintains adhesiveness, thereby reducing peeling and maintaining electroconductivity even upon bending.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching method is used to form electroconductive pattern layer, then fine pattern can be formed, but number of steps increases and production cost increases
Solution Approach 1:
The invention extracts and removes the trench formation layer after metal plating, leaving only the electroconductive pattern layer in the trench. This eliminates the need for complex etching steps while achieving fine pattern formation, as the pattern is defined by the trench geometry rather than etching processes.
Solution Approach 2:
The trench formation layer is formed in advance with the precise pattern geometry before metal plating. This preliminary structuring allows the metal to be deposited only where needed, eliminating subsequent etching steps and reducing the number of process steps while maintaining fine pattern precision.
2Reliability
If ITO or electroconductive nanowire is used, then electroconductivity and transparency are achieved, but material cost increases
Solution Approach 1:
The invention replaces expensive ITO and electroconductive nanowires with inexpensive metal plating materials such as copper, aluminum, or their alloys. The metal is deposited only in the trench region, providing cost-effective electroconductivity without requiring expensive transparent conductive materials.
Solution Approach 2:
The invention uses a composite structure combining a transparent resin base material with a metal plating layer. This composite approach achieves both transparency and electroconductivity through the combination of materials rather than relying on expensive single-material solutions like ITO.
3Quantity of substance
If electroconductive layer is formed by filling trench, then production cost is reduced, but peeling occurs and electroconductivity decreases upon bending
Solution Approach 1:
The invention forms the electroconductive pattern layer as a thin metal film within the trench structure. The trench confines the metal layer, providing mechanical support and preventing peeling during bending, while the thin film structure maintains flexibility and electroconductivity.
Solution Approach 2:
The electroconductive layer is segmented and confined within the trench boundaries rather than forming a continuous layer on the surface. This segmentation anchors the metal pattern to the underlying structure, preventing peeling and maintaining electroconductivity during flexing while reducing material usage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the production of electroconductive substrates with reduced material costs and improved flexibility, as the electroconductive pattern layer is securely integrated, preventing peeling and maintaining high electroconductivity during repeated bending.
Implementation Method 1
pushing a mold including a convex portion into the trench formation layer
Implementation Method 2
the foundation layer containing a catalyst
Implementation Method 3
forming the electroconductive pattern layer which includes metal plating and fills the trench, by growing the metal plating from the foundation layer
Data Source
AI summary
A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.