Electrode Alignment Layout for Thermal Expansion in Substrate Processing
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Solution Overview
Problem
The existing substrate processing apparatuses face issues with short circuits due to thermal expansion differences between electrodes, leading to misalignment and non-uniform thin film deposition during substrate processing.
Innovation Solution
The substrate processing apparatus is designed with protruding electrodes and insertion holes that are initially adjusted to maintain alignment, considering the differences in thermal expansion, ensuring that the centers of the electrodes remain aligned even after thermal expansion, preventing short circuits and ensuring uniform gas injection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the centers of the protruding electrodes are aligned with the centers of the insertion holes, then process gases can be uniformly injected, but thermal expansion causes misalignment and short circuits
Solution Approach 1:
The patent applies preliminary anti-action by pre-adjusting the positions of the protruding electrodes relative to the insertion holes before thermal expansion occurs. The electrodes are intentionally positioned slightly offset from the centers of the insertion holes so that when thermal expansion occurs during substrate processing, the electrodes expand into the insertion holes and achieve proper alignment, preventing short circuits while maintaining gas injection uniformity
2Manufacturing precision
If the protruding electrodes are inserted into the centers of the insertion holes, then gas injection uniformity is maintained, but thermal expansion causes electrode contact and short circuits
Solution Approach 1:
The patent applies preliminary action by pre-positioning the protruding electrodes at calculated offset distances from the centers of the insertion holes before thermal expansion occurs. This preliminary positioning accounts for the expected thermal expansion, ensuring that after expansion, the electrodes are properly aligned within the insertion holes without contacting the electrode body, thus preventing short circuits while maintaining gas injection uniformity
3Manufacturing precision
If the centers of protruding electrodes and insertion holes are aligned, then process uniformity is achieved, but thermal expansion differences cause misalignment from central to edge areas
Solution Approach 1:
The patent applies local quality by implementing different positioning strategies for different regions of the electrode array. The central electrodes are positioned with different offset distances compared to the edge electrodes, accounting for the varying thermal expansion characteristics from central to edge areas. This localized adjustment ensures that all electrodes, regardless of position, maintain proper alignment with their corresponding insertion holes during thermal expansion, preserving both process uniformity and alignment stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively prevents short circuits and maintains the uniformity of thin film deposition, even during thermal expansion, ensuring consistent processing results for substrates of various sizes.
Implementation Method 1
During substrate processing processes carried out in the substrate processing apparatus, the temperature in the chamber is increased, and the first and second electrodes are thermally expanded due to an increase in temperature
Data Source
AI summary
Provided is a substrate processing apparatus. The positions of a first electrode and a second electrode are adjusted in advance in consideration of differences in coefficients of thermal expansion so that a short circuit created by contact between the first electrode and the second electrode is prevented even in the case in which the first electrode and the second electrode are thermally expanded during processing. Even in the case in which the first electrode and the second electrode are thermally expanded due to an increase in temperature during processing, a short circuit between the first electrode and the second electrode can be prevented, and the uniformity of a thin film can be maintained in the substrate processing apparatus for processing a large substrate.