Implantable Electrode Anchoring Element for Uniform Current Distribution

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Solution Overview

Problem

Conventional implantable electrodes experience poor adhesion to polymers, leading to uneven charging and increased chances of irreversible chemical reactions due to high current density at the electrode perimeter, resulting in unpredictable tissue stimulation and device failure.

Innovation Solution

The implementation of an anchoring element, which can be a metal or insulating layer, to securely attach the electrode site to the implantable electrode, normalizing current distribution and reducing potential differences across the electrode site, thereby enhancing adhesion and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If conventional microfabrication techniques are used to connect metal to polymer in electrodes, then manufacturing is simplified, but adhesion is poor leading to device failure

Engineering Contradiction:
Improveease of manufactureVSAvoidreliability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

A conductive polymer layer is introduced as an intermediary between the metal interconnect and the polymer electrode. This conductive polymer serves as a mediator that provides both electrical conductivity and strong adhesion to both the metal and polymer layers, resolving the adhesion problem while maintaining ease of manufacture through standard layering techniques.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The electrode structure uses composite materials including a conductive polymer layer that combines the adhesion properties of polymers with the electrical conductivity needed for electrode function. This composite approach allows strong metal-to-polymer connections while maintaining manufacturability.

Inventive Principle:
Principle #40Composite materials

2Device complexity

If electrode design is simplified without anchoring elements, then device complexity is reduced, but current distribution becomes uneven causing irreversible chemical reactions

Engineering Contradiction:
Improvedevice complexityVSAvoidreliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The electrode structure is segmented into distinct functional layers including an anchoring element layer, conductive polymer layer, and electrode layer. This segmentation allows each layer to perform its specific function (mechanical anchoring, electrical conduction, electrochemical activity) while working together to achieve uniform current distribution and prevent irreversible reactions.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The anchoring element is strategically positioned at specific locations (perimeter regions) of the electrode where mechanical support and current distribution control are most needed. This localized approach provides the necessary structural reinforcement and current uniformization without adding complexity across the entire electrode structure.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10688298B2Implantable electrode and method of making the same
Publication Date: 2020.06.23 NEURONEXUS TECHNOLOGIES INC
  • US10688298B2 patent drawing
  • US10688298B2 patent drawing
  • US10688298B2 patent drawing

AI summary

An implantable electrode system of is disclosed that includes a conductive electrode layer, an interconnect coupled to the electrode layer, an insulator that insulates the interconnect, and an anchor that more securely fixes the electrode layer in place. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording or stimulating function. A method for forming such an implantable electrode system includes forming an interconnect over a base layer, forming an anchoring structure over the base layer, depositing an insulating material layer over the interconnect structure and over the anchoring structure, exposing a portion of the interconnect structure, forming an electrode layer over the insulating layer, the electrode layer contacting the exposed portion of the interconnect structure.