Multilayer Electrode Bend Geometry for Moisture-Resistant Reliability
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Solution Overview
Problem
The moisture resistance reliability of multilayer electronic components is compromised due to the formation of bent portions in internal electrodes, which can lead to delamination caused by a decrease in adhesive force between the internal electrodes and the dielectric layer, especially when the internal electrodes have different stacking degrees in capacitance formation and margin portions.
Innovation Solution
The multilayer electronic component design includes internal electrodes with controlled bent portions, where the angle of these bent portions is adjusted to ensure that the tangent of the acute angle formed by specific straight lines satisfies a range of 0.1 to 0.5, thereby enhancing moisture resistance and preventing delamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bent portions are formed in internal electrodes to connect electrodes with different polarities, then the electrical connection is improved, but the moisture resistance reliability deteriorates
Solution Approach 1:
The patent applies parameter changes by optimizing the angle of bent portions in internal electrodes. Specifically, the bent portions are designed with angles between 45-135 degrees (preferably 60-120 degrees, more preferably 90 degrees) relative to the electrode extension direction. This angular parameter optimization prevents moisture penetration while maintaining electrical connectivity, resolving the contradiction between connection reliability and moisture resistance.
2Reliability
If internal electrodes are stacked with different degrees of stacking in capacitance formation and margin portions, then the capacitance is improved, but delamination occurs due to decreased adhesive force
Solution Approach 1:
The patent applies local quality by creating different stacking configurations in specific regions. The internal electrodes have different stacking degrees in the capacitance formation portion versus the margin portion, with bent portions strategically positioned in margin areas. This localized structural differentiation enables high capacitance in the functional area while maintaining adequate adhesive force in margin areas to prevent delamination.
3Reliability
If bent portions are formed in internal electrodes, then electrode connectivity is improved, but the structural integrity deteriorates
Solution Approach 1:
The patent optimizes structural integrity through parameter control of bent portion geometry. The bent portions are designed with specific angle ranges (45-135 degrees) and are positioned in margin portions rather than capacitance formation portions. This parametric design ensures that bends occur in non-critical areas, maintaining overall structural stability while achieving electrode connectivity.
Data Source
AI summary
A multilayer electronic component includes first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween and connected to first and second external electrodes, respectively, in which the first and second internal electrodes include first and second bend portions, respectively, bent in margin regions of a body adjacent to third and fourth surfaces of the body, respectively. The present disclosure is intended to control an angle of the first and second bent portions so that the moisture resistance reliability of the multilayer electronic component is not reduced even if the bent portion is formed in a region in which the first internal electrode is adjacent to the third surface and a region in which the second internal electrode is adjacent to the fourth surface.