Electrode Binder Dispersion Evaluation by Surface Potential Mapping

The patent replaces the mechanical cutting method with an electrical measurement method. Instead of physically cutting the electrode to observe binder distribution, the invention applies current to the electrode surface and measures potential differences at multiple points. The binder dispersibility is evaluated based on the uniformity of these potential differences, thereby substituting mechanical destruction with electrical field-based non-destructive measurement.

The patent introduces electrical potential as an intermediary parameter to indirectly assess binder dispersibility. Rather than directly observing or cutting the binder distribution, the method uses potential difference measurements as a mediator that reflects the underlying binder uniformity. This intermediary approach allows evaluation without direct physical intervention that would damage the sample.

The patent segments the measurement process into multiple discrete potential difference measurement points arranged in a grid pattern on the electrode surface. By dividing the evaluation into multiple localized measurements rather than a single comprehensive measurement, the system achieves higher precision in assessing binder dispersibility across different regions of the electrode.

The patent transitions from single-point or line-based measurement to two-dimensional grid-based measurement. By arranging measurement points in rows and columns across the electrode surface, the method adds spatial dimensionality to the evaluation, enabling comprehensive assessment of binder dispersibility across the entire electrode area rather than at isolated locations.