Electrode Assembly Cleaning Fixture for Plasma Chamber Particle Control

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Solution Overview

Problem

Plasma processing chambers face challenges in minimizing particulate contamination from electrode assemblies, which can lead to defects in semiconductor substrates due to the introduction of particles during the manufacturing and handling of graphite and silicon components.

Innovation Solution

A method involving solvent cleaning, water spraying, ultrasonic cleaning, and flushing with a flushing fixture to remove particles from the surfaces and gas passages of electrode assemblies, utilizing a series of steps and tools to ensure thorough cleaning of both new and refurbished components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If electrode assemblies are used in plasma processing chambers, then substrate processing can be performed, but particulate contamination is introduced during manufacturing and handling of graphite and silicon components

Engineering Contradiction:

Improvesubstrate processing capabilityVSAvoidparticulate contamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by implementing a multi-step cleaning process (solvent cleaning, water spraying, ultrasonic cleaning, and flushing) on electrode assemblies before they are installed in plasma processing chambers. This pre-cleaning removes particles from surfaces and gas passages, preventing contamination of substrates during subsequent processing operations.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent extracts harmful particles from electrode assemblies through various cleaning methods. The flushing fixture specifically extracts particles from gas passages by circulating cleaning solutions through the electrode structure, while ultrasonic cleaning extracts particles from surfaces, thereby removing the contamination source before substrate processing.

Inventive Principle:

Principle #2Taking out (Extraction)

2Reliability

If multiple cleaning steps are applied to electrode assemblies, then particle removal is enhanced, but cleaning process complexity increases

Engineering Contradiction:

Improveparticle removal effectivenessVSAvoidcleaning process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent segments the cleaning process into distinct sequential steps: solvent cleaning for initial particle removal, water spraying for surface cleaning, ultrasonic cleaning for deep particle extraction, and flushing for gas passage cleaning. Each step targets specific contamination locations and uses appropriate cleaning mechanisms, making the complex process manageable and effective.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent uses various cleaning solutions as intermediaries to facilitate particle removal. Different liquids (solvents, water, ultrasonic cleaning solutions, flushing solutions) serve as mediators that interact with particles and electrode surfaces, enabling effective cleaning without direct mechanical contact that might damage sensitive components.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Significantly reduces the number of particles on electrode assemblies, achieving consistently low chamber particle counts and minimizing defects, thereby enhancing the yield and reliability of semiconductor processing.

Implementation Method 1

contacting the backing plate with a solvent and wiping the outer surface of the backing plate to remove particles from the outer surface

Methodology Applied

Scientific EffectDissolution: Solvation

Implementation Method 2

spraying the backing plate with water to remove particles from outer surface of the backing plate and particles contained in gas passages of the backing plate

Methodology Applied

Scientific EffectLiquid spray cleaning: Fluid Spray

Implementation Method 3

ultrasonically cleaning the backing plate

Methodology Applied

Scientific EffectUltrasonic cleaning: Ultrasonic Vibration

Implementation Method 4

flushing the backing plate with a flushing liquid in a flushing fixture that encloses the backing plate to remove particles from the outer surface of the backing plate and particles contained in the gas passages of the backing plate

Methodology Applied

Scientific EffectFluid flow through passages: Fluid Spray

Data Source

PatentUS8215321B2Methods and apparatus for wet cleaning electrode assemblies for plasma processing apparatuses

Publication Date: 2012.07.10 LAM RES CORP

AI summary

Methods of cleaning backing plates of electrode assemblies, or electrode assemblies including a backing plate and an electrode plate are provided. The methods can be used to clean backing plates and electrode plates made of various materials, such as silicon electrode plates and graphite and aluminum backing plates. The backing plates and electrode assemblies can be new, used or refurbished. A flushing fixture that can be used in the cleaning methods is also provided, the flushing fixture comprising a base plate comprising a recessed inner portion including and an upper surface configured to support the backing plate or the electrode assembly, and a cover plate configured to cover the base plate, the cover plate including at least one liquid passage through which a flushing liquid is introduced into an interior of the flushing fixture defined by the base plate and cover plate.