Electrode Embedded Member With Thin Connection Member
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Solution Overview
Problem
Existing electrode embedded members in ceramic substrates suffer from cracking due to thermal expansion differences between the substrate and connection members, leading to compromised insulation performance.
Innovation Solution
The electrode embedded member incorporates a connection member with a thickness of 0.2 mm or smaller, a cutout portion, or a mesh structure, which allows for stress reduction and deformation, thereby preventing cracks in the insulation layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a connection member with conventional thickness is used, then the connection member provides sufficient structural support, but thermal expansion stress causes cracks in the substrate
Solution Approach 1:
The connection member's thickness is changed from conventional dimensions to 0.2 mm or smaller, fundamentally altering its mechanical properties. This parameter change allows the connection member to be more compliant to thermal expansion while maintaining sufficient structural support, thereby preventing substrate cracks during temperature cycling
Solution Approach 2:
The connection member is designed as a thin film structure with thickness of 0.2 mm or smaller, which provides flexibility to accommodate thermal expansion differences between the ceramic substrate and the connection member itself, reducing stress concentration that would otherwise cause cracking
2Reliability
If the connection member volume is reduced to suppress thermal stress, then crack formation is prevented, but the connection member's structural strength may be compromised
Solution Approach 1:
The connection member is constructed from composite materials that combine high strength-to-volume ratio properties. This allows the connection member to maintain adequate structural strength while having reduced volume (thickness of 0.2 mm or smaller) to suppress thermal expansion stress and prevent substrate cracking
Solution Approach 2:
The connection member incorporates curved or rounded geometric features rather than sharp corners, which distributes stress more evenly throughout the structure. This curvature design maintains structural integrity even with reduced volume, preventing stress concentration points that would lead to failure
3Ease of manufacture
If a solid connection member structure is used, then manufacturing is simple, but internal stress accumulates during thermal cycling
Solution Approach 1:
The connection member is segmented into a mesh structure composed of multiple interconnected elements rather than a solid continuous structure. This segmentation allows each element to independently accommodate thermal expansion, significantly reducing internal stress accumulation during thermal cycling while remaining manufacturable through standard processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described structure effectively suppresses crack formation and maintains insulation performance by reducing internal stress and enhancing adhesion between the connection member and the ceramic substrate, ensuring high reliability even under thermal cycling.
Implementation Method 1
a stress that is induced due to the difference in physical properties between the connection member and the base material, which is a ceramic, can be suppressed
Data Source
AI summary
An electrode embedded member includes a plate-shaped substrate having a front surface and a back surface and that is made of a ceramic, an inner electrode extending parallel to the front surface of the substrate and that is embedded in the substrate, a connection member extending parallel to the front surface of the substrate and that is disposed so as to overlap the inner electrode, and a terminal connected to the connection member. The electrode embedded member has a predetermined structure including at least one of the following: a first predetermined structure in which a thickness of at least a part of the connection member in a direction perpendicular to the front surface of the substrate is 0.2 mm or smaller; a second predetermined structure in which the connection member includes a cutout portion; and a third predetermined structure in which the connection member is composed of a mesh structure.